Routable Layer Columns for IC Packaging Footprint Reduction
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Solution Overview
Problem
Current integrated circuit packaging technologies face challenges in achieving smaller footprints, higher reliability, and lower costs while addressing issues like EMI radiation, thermal loads, and second-level assembly reliability stresses, particularly in the context of increasing complexity and diminishing opportunities for product differentiation in the market.
Innovation Solution
The implementation of a routable layer with columns and gamma connectors to electrically connect integrated circuit structures, which enhances functionality, input/output density, mechanical reliability, and signal transmission, and reduces complexity and costs by using vias and redistribution layers to create compact and stable packaging systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional packaging structures are used, then manufacturing simplicity is maintained, but device footprint and complexity increase
Solution Approach 1:
The patent implements nesting by placing the integrated circuit structure directly within the routable layer structure, eliminating the need for separate packaging layers. The IC structure is nested within the carrier substrate, with columns extending through the substrate to provide electrical connections, creating a compact integrated assembly that reduces overall footprint while maintaining functionality
Solution Approach 2:
The patent merges multiple functional elements into a single integrated structure. The carrier substrate combines mechanical support, electrical routing, and connection functions. The columns serve both as structural elements and as electrical interconnects, eliminating the need for separate wire bonds or solder connections, thereby reducing packaging complexity and footprint
2Ease of manufacture
If packaging complexity is reduced, then manufacturing cost decreases, but reliability may worsen
Solution Approach 1:
The patent applies preliminary action by pre-forming the columns within the carrier substrate before mounting the integrated circuit structure. The columns are created as through-substrate vias or conductive structures that are ready to receive and electrically connect to the IC structure, ensuring proper alignment and connection before final assembly. This pre-preparation reduces manufacturing complexity while maintaining reliability through precise pre-positioning
Solution Approach 2:
The carrier substrate serves multiple functions simultaneously: it provides mechanical support, electrical routing through the columns, thermal management pathways, and structural alignment features. This multi-functionality reduces the need for additional specialized components, simplifying manufacturing while enhancing reliability through integrated design
3Reliability
If direct contact mounting is used, then connection reliability improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements self-service through self-aligning features built into the carrier substrate and IC structure. The columns are positioned to automatically align with corresponding pads or contacts on the IC structure during placement. The routable layer geometry and column positioning provide inherent alignment cues that guide the IC structure into correct position, reducing the precision requirements for external alignment while ensuring reliable direct contact connections
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a routable layer having a column; mounting an integrated circuit structure in direct contact with the column; and forming a gamma connector to electrically connect the column to the integrated circuit structure.