Routable Trace IC Packaging with Protective Coat
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in reducing package size, cost, and increasing functionality while maintaining reliability and thermal conductance, as they struggle with complex bond layouts and thermal distortion leading to electrical disconnections.
Innovation Solution
The integration of routable traces with a top plate and a second routable trace, encapsulation with a hole, and a protective coat directly on the encapsulation with the routable trace, which provides structural integrity and electrical isolation, reducing package size and improving thermal conductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If existing manufacturing processes are reused, then manufacturing cost is reduced, but package dimensions cannot be reduced
Solution Approach 1:
The package structure is segmented into distinct functional layers: the leadframe substrate, the encapsulation body, and the protective coat system. This segmentation allows each component to be optimized independently using existing manufacturing processes while contributing to overall size reduction through efficient spatial arrangement and material selection.
2Volume of moving object
If package size is reduced, then space requirement is decreased, but thermal conductance and reliability deteriorate
Solution Approach 1:
The package employs composite material structures including the encapsulation body combining molding compound with integrated heat dissipation features, and the protective coat system layering different materials for electrical isolation and thermal management. These composite structures enable simultaneous achievement of compact size, reliable thermal conductance, and electrical connection stability.
3Device complexity
If complex bond layouts are eliminated, then manufacturing complexity is reduced, but thermal distortion and electrical disconnections increase
Solution Approach 1:
The protective coat system acts as an intermediary layer between the encapsulation body and the external environment, providing electrical isolation that prevents disconnections while accommodating thermal distortion. This intermediary structure eliminates the need for complex bond layouts by providing a stable, flexible protective barrier that maintains electrical integrity under thermal stress.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing routable traces including a first routable trace with a top plate and a second routable trace; mounting an integrated circuit partially over a second routable trace; forming an encapsulation over and around the first routable trace and the integrated circuit; forming a hole through the encapsulation to the top plate; and forming a protective coat directly on the encapsulation with the first routable trace between and in contact with the protective coat and the encapsulation.