Routing Layer Leaded Package for Flexible Die Contact Layouts
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Solution Overview
Problem
Existing integrated circuit packaging technologies face challenges in efficiently connecting integrated circuit dies with different contact layouts to package contacts, while maintaining a compact and high-power-density package.
Innovation Solution
A leaded package design that incorporates a routing layer between the integrated circuit die and package contacts, allowing for flexible connection of die contacts to package contacts regardless of their layouts, thereby enabling the use of a single package contact layout for various integrated circuit dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a routing layer is introduced to connect die contacts to package contacts, then adaptability to different die contact layouts is improved, but device complexity increases
Solution Approach 1:
A routing layer is introduced as an intermediary component between the die contacts and package contacts. This routing layer includes conductive traces that can be configured to match different die contact layouts, allowing a single package contact layout to accommodate multiple die types. The routing layer acts as a mediator that transforms the connection between die and package, enabling adaptability without requiring multiple package contact configurations.
2Volume of moving object
If die contacts and package contacts are positioned in close proximity, then package size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The routing layer is pre-configured with conductive traces that define the connection paths between die contacts and package contacts before the die is mounted. This preliminary configuration of the routing layer establishes the alignment references and connection geometry in advance, reducing the precision requirements during the actual die mounting process. The routing layer serves as a pre-prepared intermediary that guides the connection process.
3Adaptability or versatility
If a routing layer is used to connect die contacts to package contacts, then adaptability to various die types is improved, but the number of components increases
Solution Approach 1:
The routing layer is designed as a universal component that can accommodate multiple die types with different contact layouts. By configuring the conductive traces in the routing layer to match different die contact patterns, a single package contact layout can interface with various integrated circuit dies. This multi-functional approach allows the routing layer to serve multiple purposes: adapting to different die types, providing electrical connections, and maintaining a standardized package interface.
Data Source
AI summary
A package for an integrated circuit die (e.g., a chip). A routing layer is layered between the chip and package contacts of the package. The chip has a planar surface along which the chip includes die contacts. The routing layer lies along the planar surface of the chip, and electrically connects the die contacts of the chip to the package contacts of the package. This allows the chip, the routing layer, and the package contacts to be stacked together to form a relatively thin, compact package. The routing layer connects the die contacts of the chip to the package contacts of the package, such that the die contacts need not have the same layout as the package contacts, thus allowing packages with the same package contact layouts to be used to package chips with varying die contact layouts. A lead in conductive contact with the package contact.