Stacked Imaging Sensor Failure Detection by Row Signal Timing
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Solution Overview
Problem
Current imaging devices with stacked substrates cannot effectively detect failures, which is crucial for ensuring safe driving support functions in vehicles, as erroneous detection can lead to inadequate safety measures.
Innovation Solution
An imaging apparatus with a first substrate containing pixels and a second substrate including a row drive unit and a failure detector, where the substrates are stacked and electrically connected through connection electrodes, allowing the failure detector to identify operational failures by monitoring control signals and pulse outputs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If substrates are stacked to reduce imaging device size, then miniaturization is achieved, but failure detection capability deteriorates
Solution Approach 1:
The imaging device is segmented into multiple functional substrates (sensor substrate and circuit substrate) stacked together. The failure detection function is further segmented as a separate circuit module that can independently monitor signal integrity between substrates without interfering with normal imaging operations.
Solution Approach 2:
A failure detector circuit acts as an intermediary between the row drive unit and the pixel array. This intermediary monitors the control signals passing through connection electrodes, detecting failures in signal transmission between stacked substrates without disrupting the primary imaging function.
2Device complexity
If substrates are stacked to improve integration, then device complexity is reduced, but measurement of control signal integrity becomes difficult
Solution Approach 1:
The failure detector is configured to preliminarily check control signals before they reach the pixel array through connection electrodes. By performing detection in advance, the system can identify signal transmission failures between substrates before they affect imaging operations.
Solution Approach 2:
The failure detector provides feedback about the integrity of control signals transmitted between stacked substrates. This feedback mechanism enables continuous monitoring of connection electrode functionality, allowing the system to detect and report failures in the stacked substrate architecture.
Data Source
AI summary
The present disclosure relates to an imaging apparatus and an imaging method, a camera module, and an electronic apparatus that are capable of detecting a failure in an imaging device having a structure in which a plurality of substrates are stacked.The timing at which a row drive unit provided in a second substrate outputs a control signal for controlling accumulation and reading of pixel signals in a pixel array provided in a first substrate is compared with the timing at which the control signal output from the row drive unit is detected after passing through the pixel array. Depending on whether or not the timings coincides with each other, a failure is detected. The present disclosure can be applied to an imaging apparatus mounted on a vehicle.