RPC Inlet Adapter Tapered Surfaces for Particle Back-Streaming
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Solution Overview
Problem
Conventional chamber cleaning techniques for semiconductor substrate processing result in substantial reaction of cleaning gases with chamber surfaces, leading to incomplete etching of residue deposits and increased particle excursions, which accumulate as adders on the substrate.
Innovation Solution
A gas delivery apparatus with tapered surfaces is used to remove residue deposits from process chambers, where the tapered surfaces surround inlet ports to prevent particle accumulation and facilitate controlled removal of particles by the flowing gas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional chamber cleaning techniques are used, then cleaning gases can react with chamber surfaces, but this results in incomplete etching of residue deposits and increased particle excursions
Solution Approach 1:
The gas delivery apparatus is segmented into multiple inlet ports distributed across the chamber, allowing cleaning gas to be delivered to multiple locations simultaneously. This segmentation prevents particle accumulation at any single location and ensures more uniform cleaning coverage.
Solution Approach 2:
The invention transitions from a single-point or limited-point gas delivery to a multi-dimensional distribution system with inlet ports positioned at different locations and orientations within the chamber, enabling three-dimensional coverage of cleaning gas throughout the chamber volume.
2Productivity
If cleaning gases are introduced into the process chamber, then residue deposits can be removed, but reactions with chamber surfaces cause incomplete etching and particle accumulation
Solution Approach 1:
A constant flow of inert gas is introduced as an intermediary substance to carry particles away from the chamber walls and through the inlet ports. This intermediary gas flow prevents particles from accumulating on surfaces while maintaining the cleaning action of the primary cleaning gas.
Solution Approach 2:
The invention uses pneumatic flow of inert gas to transport particles through the gas delivery apparatus. The gas flow dynamics are designed to create a continuous stream that sweeps particles away from reaction zones and prevents their accumulation on chamber surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of tapered surfaces in the gas delivery apparatus reduces particle accumulation and back-streaming, enhancing the efficiency of residue removal and minimizing the number of adders on the substrate during processing.
Implementation Method 1
a constant flow of inert gas through the body of the RPS, across the swept surfaces, and into the showerhead
Data Source
AI summary
A gas delivery apparatus includes an inlet portion and an outlet portion. The inlet portion can comprise a plurality of inlet ports configured to receive gas from a gas source. The inlet portion can also comprise a corresponding plurality of tapered surfaces associated with the plurality of inlet ports. Each tapered surface of the plurality of tapered surfaces surrounds a corresponding inlet port of the plurality of inlet ports. The outlet portion can be configured to deliver the gas to a gas showerhead of a process chamber. Each tapered surface of the plurality of tapered surfaces can comprise a first region and a second region. The first region is associated with a first curvature. The second region is associated with a second curvature. The first curvature can be different from the second curvature.