Airflow Restrictor Panel for RTM Cooling Distribution

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Solution Overview

Problem

Current AdvancedTCA chassis cooling systems inefficiently distribute air flow, directing excessive air to Rear Transition Modules (RTMs) despite their lower power dissipation needs, leading to unnecessary energy consumption and acoustic noise.

Innovation Solution

An air flow restrictor panel is secured within the electronics enclosure to control and reduce the volume of air flow to RTMs, allowing only a predetermined subquantity to pass through, thereby optimizing air distribution and improving cooling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the cooling system distributes air flow proportionally to the card cage area (25% to RTMs), then the air flow distribution follows the area ratio, but the cooling efficiency deteriorates because RTMs require only 0.125% of the power dissipation of front boards

Engineering Contradiction:
Improveair flow distribution simplicityVSAvoidcooling efficiency
Core Design Contradiction:
Ease of operationVSLoss of energy

Solution Approach 1:

The patent applies local quality by creating different air flow resistance characteristics in different regions of the card cage. Flow restrictors are selectively placed in RTM slots to create higher local resistance, while front board slots maintain lower resistance. This ensures that each region receives air flow proportional to its actual cooling needs rather than its physical area, directly resolving the contradiction between simple area-based distribution and efficient cooling.

Inventive Principle:
Principle #3Local quality

2Reliability

If high volume air flow is directed through RTMs to ensure adequate cooling, then cooling reliability is improved, but energy consumption increases and acoustic noise is generated

Engineering Contradiction:
Improvecooling adequacyVSAvoidsystem energy consumption
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The patent changes the air flow parameter (volume) through RTMs by introducing flow restrictors that increase local resistance. This reduces the air flow volume through RTMs from what would be required by area-based distribution to the actual minimum needed for adequate cooling of low-power components. The parameter change directly addresses the contradiction by maintaining cooling reliability while reducing excessive energy consumption and noise.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If the cooling system is designed based on total RTM area versus front board area ratio, then the design follows standardized specifications, but the actual power dissipation requirements are not met

Engineering Contradiction:
Improvedesign standardizationVSAvoidcooling requirement matching
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies local quality by differentiating air flow characteristics between RTM and front board regions. Flow restrictors are selectively installed only in RTM slots, creating localized high-resistance zones. This allows the overall system to follow standardized area-based design while achieving precision in matching actual power dissipation requirements through local modification of air flow properties.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances cooling efficiency by directing more air flow to front boards, potentially reducing the cooling system's power requirements and energy consumption, while minimizing unnecessary air flow and noise.

Implementation Method 1

The panel may have a plurality of openings so that the panel reduces a volume of a cooling air flow flowing through the panel by a predetermined desired degree

Methodology Applied
Scientific EffectFlow resistance: Drag

Data Source

PatentUS20100216389A1System and Method For Restricting Airflow Through A Portion Of An Electronics Enclosure
Publication Date: 2010.08.26 SMART EMBEDDED COMPUTING INC
  • US20100216389A1 patent drawing
  • US20100216389A1 patent drawing
  • US20100216389A1 patent drawing

AI summary

An apparatus is disclosed for restricting air flow through an electronics enclosure. The apparatus may include a panel having at least one edge adapted to be secured to a surface of the electronics enclosure to thus place the panel in a path of a cooling air flow flowing through a cardcage portion of the enclosure. The panel may have a footprint that at least substantially fills an opening through which said cooling air flow flows through said cardcage portion of the enclosure. The panel may have a plurality of openings so that the panel reduces a volume of a cooling air flow flowing through the panel by a predetermined desired degree, and thus reduces a volume of the air flow through the cardcage to a desired volume.