Rapid Thermal Processing for Block Copolymer Self-Assembly
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Solution Overview
Problem
Conventional photolithographic techniques are inadequate for manufacturing microelectronic devices with feature sizes smaller than 30 nanometers due to optical diffraction limitations, and existing nanolithographic methods using self-assembled block copolymer films face challenges in accurately controlling the self-assembling process and physico-chemical properties, particularly due to lengthy thermal treatments that are costly and inefficient.
Innovation Solution
A process utilizing Rapid Thermal Processing (RTP) to control the self-assembling of block copolymer films by heating them up to specific target temperatures with rapid temperature ramps and short isothermal holds, followed by cooling, to achieve precise control over the self-assembly of block copolymers on substrates, reducing treatment times and enhancing process accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photolithographic techniques are used, then manufacturing process is simple and well-established, but feature size cannot be smaller than 30 nanometers due to optical diffraction limitations
Solution Approach 1:
The patent introduces block copolymer films as an intermediary material that self-assembles into nanoscale patterns. These polymers act as a mediating layer between the substrate and the final device structure, enabling sub-30nm feature sizes through their inherent self-organization capability rather than direct lithographic patterning
Solution Approach 2:
The patent changes the fundamental parameter from optical wavelength (diffraction-limited) to polymer chain length and composition (tunable at nanoscale). By controlling block copolymer composition, molecular weight, and solvent conditions, feature sizes below 30nm are achieved through parameter optimization rather than increasing lithographic complexity
2Manufacturing precision
If lengthy thermal treatments are used for self-assembling block copolymer films, then self-assembly is achieved, but treatment time is long and manufacturing cost is high
Solution Approach 1:
The patent applies preliminary actions by pre-functionalizing the substrate surface with specific chemical groups (e.g., hydroxyl, carboxyl, or amine groups) before introducing the block copolymer. This pre-preparation creates favorable interaction sites that guide rapid self-assembly, eliminating the need for lengthy thermal treatments
Solution Approach 2:
The patent changes the thermal treatment parameters from conventional slow heating (hours) to rapid thermal processing (seconds to minutes). By optimizing the heating rate, peak temperature, and hold time, the patent achieves complete self-assembly with dramatically reduced treatment duration, lowering both time loss and manufacturing cost
3Productivity
If rapid thermal processing is used to reduce treatment time, then productivity increases, but control of self-assembling parameters becomes more difficult
Solution Approach 1:
The patent implements feedback control by monitoring key parameters during rapid thermal processing (temperature, time, atmosphere) and adjusting them in real-time to maintain optimal self-assembly conditions. This closed-loop control ensures that even with rapid processing, the block copolymer films achieve the desired nanoscale precision and uniformity
Solution Approach 2:
The patent employs dynamic processing where temperature, time, and atmospheric conditions are continuously adjusted during the self-assembly process. Rather than static conditions, the system evolves dynamically to guide the block copolymers through nucleation, growth, and ordering phases, achieving precise control despite rapid processing speeds
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces thermal treatment durations, lowers manufacturing costs, and allows for precise control of self-assembling parameters, making it compatible with current semiconductor technologies while maintaining the presence of residual solvent to enhance the self-assembling process.
Implementation Method 1
The third step of BCP self-assembling
Implementation Method 2
the self-assembling of the copolymer may have the parallel lamellae orientation of FIG. 1A, the perpendicular lamellae orientation of FIG. 1B
Implementation Method 3
the self-assembling step C is made through a first RTP process of Rapid Thermal Processing comprising the following substeps: C.1 heating the first intermediate product up to a first target temperature
Implementation Method 4
heating the first intermediate product up to a first target temperature, ranging from a glass transition temperature Tg of said at least one block copolymer to an order-disorder transition temperature TODT of said at least one block copolymer
Implementation Method 5
heating the first intermediate product up to a first target temperature, ranging from a glass transition temperature Tg of said at least one block copolymer to an order-disorder transition temperature TODT of said at least one block copolymer
Data Source
AI summary
Self-assembled block copolymer films having two or more blocks are manufactured by distributing a solution containing at least one block copolymer onto the substrate so as to partially coat a substrate surface, obtaining an intermediate product. A block copolymer is self-assembled by heating the intermediate product. The self-assembling step includes Rapid Thermal Processing, which is performed by heating the intermediate product up to a first target temperature, ranging from a glass transition temperature to an order-disorder transition temperature of the block copolymer, through a temperature rising ramp having a rate of temperature change not lower than 5° C./second; maintaining the intermediate product at the target temperature for a time interval not longer than 60 minutes, whereby a sample is obtained on the surface of which a self-assembled film of the block copolymer has been made; and cooling the sample down to the ambient temperature through a temperature descending ramp.