Ruggedized Computer Enclosure With Monolithic Forced-Air Cooling
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Solution Overview
Problem
Existing ruggedized computers are inefficient in terms of space, power, and performance, unable to handle high thermal output, and are not modular for upgrades, often failing in harsh environments due to inadequate cooling and shock resistance.
Innovation Solution
A universal ruggedized enclosure with a monolithic heat exchanger core and forced air cooling system, utilizing a complex lattice structure and heat pipes to dissipate heat efficiently, while being sealed from the environment and integrating high-performance components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealed pelican case is used to ruggedize a desktop computer, then protection from environmental variables is improved, but the form factor becomes large and space efficiency deteriorates
Solution Approach 1:
The patent combines the enclosure structure with the heat exchanger into a single integrated unit. The enclosure walls themselves form the heat exchanger channels, eliminating the need for separate cooling components and reducing overall volume while maintaining protection and cooling functionality
Solution Approach 2:
The enclosure serves multiple functions simultaneously: it provides mechanical protection, acts as a heat exchanger for cooling, and maintains structural integrity. This multi-functionality reduces the number of separate components needed, thereby reducing overall volume
2Temperature
If air conditioning unit or Peltier device is used for cooling the air inside the case, then cooling capability is improved, but space requirement and power consumption increase
Solution Approach 1:
The heat exchanger is merged with the enclosure structure itself, with cooling channels formed within the enclosure walls. This eliminates the need for separate air conditioning units or Peltier devices, significantly reducing space requirements while maintaining effective cooling
Solution Approach 2:
The enclosure structure itself performs the cooling function through its integrated heat exchanger channels. The system uses the enclosure's own structure to dissipate heat rather than requiring external cooling equipment, reducing space and power requirements
3Temperature
If air conditioning unit is used for cooling, then cooling capability is improved, but power consumption and cost increase
Solution Approach 1:
The passive heat exchanger structure requires no external power source to function. Heat is dissipated naturally through the enclosure walls' internal channels, eliminating the power consumption associated with active cooling systems like air conditioners or Peltier devices
Solution Approach 2:
The patent extracts the active cooling components (air conditioning units, Peltier devices) from the system and replaces them with a passive heat exchanger structure, eliminating the associated power consumption and cost
4Reliability
If COTS ruggedized computers are used, then ruggedization is improved, but compute performance and hardware upgradability deteriorate
Solution Approach 1:
The system is segmented into modular components: a ruggedized enclosure and separate computer hardware. This allows the computer components to be upgraded independently while maintaining the ruggedized enclosure, combining ruggedization with hardware upgradability
Solution Approach 2:
The enclosure is designed to accommodate various computer configurations and upgrades while maintaining its ruggedized protection. The universal enclosure design allows different computer components to be integrated without sacrificing ruggedization capabilities
5Power
If desktop computer is integrated on ground platform, then compute performance is improved, but shock resistance deteriorates due to limited shock dampening
Solution Approach 1:
The shock dampening features are merged into the enclosure structure itself, with vibration isolation elements integrated into the enclosure walls and mounting points. This provides shock protection for high-performance computer components without requiring separate dampening systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enclosure provides effective cooling and protection in rugged environments, allowing integration of high-performance components without additional infrastructure, maintaining optimal performance and compact form factor.
Implementation Method 1
The enclosure wall structure includes therein an internal geometry of a monolithic heat exchanger core of a monolithic heat exchanger having a plurality of internal channels
Implementation Method 2
one or more fans configured to drive air via one or more inlets from an enclosure exterior outside of the enclosure wall structure through the internal channels
Data Source
AI summary
In one embodiment, an enclosure device for a printed circuit board (PCB) includes: an enclosure wall structure enclosing an enclosure interior which has a PCB space in which to dispose the PCB, the enclosure wall structure including therein an internal geometry of a monolithic heat exchanger core of a monolithic heat exchanger having a plurality of internal channels, the enclosure wall structure including one or more vents; and one or more fans configured to drive air via one or more inlets from an enclosure exterior outside of the enclosure wall structure through the internal channels and out of the one or more vents. The enclosure wall structure is configured to block air flowing through the internal channels from entering the enclosure interior.