Ruggedized Miniaturized Infrared Camera Thermal Management
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Solution Overview
Problem
Conventional infrared cameras fail to withstand harsh aerospace environments due to inadequate heat removal, vibration tolerance, off-gassing issues, and large size, which limits their operational life and compatibility in aviation and space applications.
Innovation Solution
A ruggedized miniaturized infrared camera system is developed, integrating a miniaturized camera module with a ruggedized camera mount and using military-spec fasteners, a compact design, and passive cooling with heat-conductive epoxy to secure components and enhance thermal bonding, while minimizing mechanical gaps and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional infrared cameras are used in aerospace environments, then basic imaging function is provided, but they fail to withstand harsh environments including extreme temperatures, high radiation, and severe vibrations
Solution Approach 1:
The camera system is divided into modular components including the camera module, ruggedized camera mount, interface bracket, and lens clamp member. This segmentation allows each component to be optimized for specific environmental requirements and facilitates replacement or maintenance of individual parts without affecting the entire system.
Solution Approach 2:
The camera module is pre-assembled and tested as a complete unit before integration into the aerospace platform. The ruggedized camera mount and interface bracket are pre-configured with appropriate fasteners and mounting mechanisms to ensure immediate readiness for harsh environment operation without requiring field adjustments.
2Reliability
If conventional infrared cameras with active cooling are used, then imaging function is maintained, but large power and mass requirements result
Solution Approach 1:
The active cooling system is extracted and removed from the camera design. Instead of using mechanical coolers requiring power and mass, the system relies on passive cooling through thermal conduction to the camera mount and interface bracket, which are designed with appropriate thermal pathways and materials.
Solution Approach 2:
The camera module utilizes the aerospace platform's natural thermal environment and the thermal mass of the ruggedized camera mount and interface bracket to passively dissipate heat. The system serves its own cooling needs through carefully designed thermal conduction pathways without external active cooling equipment.
3Reliability
If conventional infrared cameras with large connectors are used, then electrical connection is established, but the camera frame or housing exceeds maximum weight and volume requirements
Solution Approach 1:
The electrical connector is integrated directly into the camera housing structure rather than being a separate external component. The interface bracket incorporates mounting features and electrical connection points that are combined with the structural elements, eliminating the need for large external connector assemblies.
Solution Approach 2:
The ruggedized camera mount and interface bracket serve multiple functions simultaneously: mechanical mounting, structural support, thermal conduction, and electrical connection. This multi-functionality eliminates the need for separate dedicated components for each function, reducing overall system volume and mass.
4Temperature
If conventional infrared cameras are used, then imaging is performed, but they do not sufficiently remove heat in a vacuum environment
Solution Approach 1:
Active mechanical cooling systems are replaced with passive thermal conduction mechanisms. The camera module, ruggedized camera mount, and interface bracket form a continuous thermal pathway that conducts heat away from the camera sensor and electronics through solid material contact, effective in vacuum environments where convection and evaporation are unavailable.
Solution Approach 2:
The system utilizes composite construction with materials selected for their thermal conduction properties. The camera mount and interface bracket incorporate materials with high thermal conductivity to efficiently transfer heat from the camera module to the aerospace platform structure, while maintaining mechanical strength and vibration resistance.
5Ease of operation
If conventional infrared cameras with standard USB connectors are used, then data transmission is enabled, but they were not designed for harsh environments and lack vibration tolerance
Solution Approach 1:
The electrical connector and data transmission interface are pre-configured and rigidly mounted within the camera housing and interface bracket structure. The connector positioning and securing are performed during manufacturing to ensure proper alignment and mechanical strength before the system experiences vibration or shock during operation.
Solution Approach 2:
The interface bracket and camera mount incorporate localized reinforcement and vibration-damping features at critical connection points. The structural design provides enhanced rigidity and shock absorption specifically at the electrical connector mounting locations while maintaining overall system compactness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively withstands launch load environments and provides improved heat removal, reduced mass and volume, and enhanced vacuum compatibility, ensuring reliable operation in aerospace settings.
Implementation Method 1
Heat conductive epoxy is applied to the electronic circuit board to secure electronic components from vibrations and to create thermal bonds that passively remove heat
Implementation Method 2
An electrically non-conductive spacer is positioned within the central opening and is interposed between the electrical signal connector and the electronic circuit board in order to maintain a gap between the electronic circuit board and the electrical signal connector
Implementation Method 3
Military-spec fasteners are used to mechanically connect the infrared camera module to the ruggedized camera mount. The ruggedized camera mount and military-spec fasteners cooperate to mechanically secure the infrared camera module from vibrations
Implementation Method 4
Heat conductive epoxy is applied to the electronic circuit board to secure electronic components from vibrations and to create thermal bonds that passively remove heat
Data Source
AI summary
A ruggedized miniaturized infrared camera system for harsh environments has an infrared camera module that is connected to a ruggedized camera mount. The camera mount has a body and a lens clamp that clamps the camera lens to the body. The camera mount and military-spec fasteners cooperate to mechanically secure the camera module from vibrations. An interface bracket is attached to the camera mount and has a central opening. A signal connector is attached to the exterior side of the bracket and configured to carry USB2 signals. Conductive pins of the signal connector extend through the central opening and are electrically coupled to a circuit board that is adjacent to the interior side of the bracket. An electrically non-conductive spacer is within the central opening and interposed between the signal connector and circuit board. Heat-conductive epoxy secures the circuit board from vibrations and creates thermal bonds that passively remove heat.