Ruggedized Wafer Electrical Connector With Integrated Alignment
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Solution Overview
Problem
Conventional electrical connectors for circuit boards often require separate alignment pins, which occupy board space and do not provide adequate shock absorption or float capability, leading to potential issues with vibration and alignment during mating.
Innovation Solution
The use of wafers with integrated shielding members and shock-absorbing components, along with a guidance member that eliminates the need for separate alignment pins, allowing for a more compact and ruggedized connector assembly with float capability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate alignment pins are used for connector alignment, then alignment precision is improved, but board space is consumed and device complexity increases
Solution Approach 1:
The alignment function is merged with the connector housing itself. The housing includes integrated alignment features such as guide rails, positioning protrusions, or tapered sections that directly provide alignment guidance during mating, eliminating the need for separate alignment pins and freeing up board space.
Solution Approach 2:
The connector housing is designed to serve multiple functions simultaneously: it provides mechanical support, electrical insulation, and alignment guidance. By incorporating alignment features into the housing structure, the same component performs both protective and alignment functions, reducing the total number of parts required.
2Measurement precision
If separate alignment pins are used for connector alignment, then alignment precision is improved, but device complexity increases
Solution Approach 1:
The alignment function is merged with the connector housing itself. The housing includes integrated alignment features such as guide rails, positioning protrusions, or tapered sections that directly provide alignment guidance during mating, eliminating the need for separate alignment pins and freeing up board space.
Solution Approach 2:
The separate alignment pins are extracted from the connector assembly and their function is transferred to the housing structure. This reduces the number of discrete components and simplifies the overall device architecture while maintaining alignment precision.
3Reliability
If conventional connector design is used without shock absorption, then device complexity is reduced, but reliability deteriorates under vibration and shock
Solution Approach 1:
Shock-absorbing elements such as compliant members, elastomeric dampers, or spring-loaded contacts are incorporated into the connector design to preemptively mitigate the effects of vibration and shock. These elements are positioned to absorb mechanical stresses before they can damage the electrical contacts or compromise connection reliability.
Solution Approach 2:
The connector assembly utilizes composite construction combining rigid housing materials with flexible or elastomeric shock-absorbing materials. This composite approach provides both structural integrity and vibration damping without requiring entirely separate shock-absorption mechanisms.
4Adaptability or versatility
If connector design allows float capability, then adaptability to misalignment is improved, but manufacturing precision requirements increase
Solution Approach 1:
The connector incorporates dynamic elements such as compliant contacts, spring-loaded mating surfaces, or floating sections that allow the connector to adapt its position during mating. These dynamic features enable the connector to compensate for minor misalignments through elastic deformation or controlled movement, providing float capability while maintaining reliable electrical contact.
Data Source
AI summary
A ruggedized, two-piece electrical connector. One piece, which may be configured for mounting to a daughtercard, is assembled from wafers. Each wafer includes a shield member and signal contacts held by an insulative member. Within the insulative member, the signal and ground contacts run in spaced, parallel planes. Both signal and ground contacts terminate in pads along a mating segment of the connector. The second piece of the connector, which may be configured for mounting to a backplane, has a housing with slots to receive the mating segments of the wafers. Within the slots, the backplane connectors have contacts that provide at least four points of contact with each pad. The contact points are at least two different heights on each side of the pad.