Ruler SSD Array Positioning for Data Center Processor Cooling
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Solution Overview
Problem
Traditional rack systems in data centers face challenges in dissipating heat effectively due to the close proximity and arrangement of heat-producing components, leading to thermal shadowing that impairs the cooling of processors and reduces their thermal design power.
Innovation Solution
The use of a 'ruler' form factor solid state drive array positioned centrally, with fan arrays mounted on either side to ensure linear airflow that avoids thermal shadowing of processors, allowing for improved cooling and increased thermal design power.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple heat-producing components are arranged in close proximity in traditional rack systems, then device density is improved, but thermal shadowing occurs that impairs processor cooling and reduces thermal design power
Solution Approach 1:
The patent repositions the SSD array from a traditional side-mounted configuration to a central location along the airflow path, utilizing the depth dimension of the server sled more effectively. This dimensional rearrangement allows fan arrays to be positioned on opposite sides of the SSD array, creating symmetric airflow paths that directly cool processors without thermal shadowing, thereby resolving the contradiction between device density and cooling efficiency
Solution Approach 2:
The SSD array serves as an intermediary structure that the airflow passes through on its way from the fan arrays to the processors. By positioning the SSD array centrally in the airflow path rather than at the periphery, the design allows cooling air to flow through and around the SSD array to reach the processors, eliminating thermal shadowing while maintaining high device density
2Temperature
If fan arrays are positioned to cool processors, then cooling efficiency is improved, but thermal shadowing from other components reduces the effectiveness of the cooling airflow
Solution Approach 1:
The patent employs asymmetric positioning of components relative to the airflow path. The SSD array is positioned centrally in the airflow direction, while fan arrays are positioned asymmetrically on opposite sides, creating non-uniform airflow distribution that strategically directs cool air around the SSD array to reach processors, minimizing thermal shadowing effects
Solution Approach 2:
By utilizing the vertical and lateral dimensions within the server sled enclosure, the design positions fan arrays at different locations along the airflow path rather than directly adjacent to processors. This multi-dimensional arrangement allows cooling airflow to navigate around heat-producing components like the SSD array, delivering cool air to processors without being blocked by thermal shadowing
3Power
If processors are positioned to maximize performance, then computational capability is improved, but heat dissipation becomes more difficult due to close proximity with other heat-producing components
Solution Approach 1:
The design uses the SSD array as an intermediary element through which cooling airflow passes to reach processors. This arrangement allows processors to be positioned in close proximity to other high-performance components for maximized computational capability, while the airflow intermediary approach ensures efficient heat dissipation by directing cool air through and around the SSD array to reach processor hot spots
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the thermal design power of processors, increasing their performance by reducing thermal shadowing and enabling higher core counts, memory capacity, and core frequencies, suitable for high-performance computing applications.
Implementation Method 1
a fan array mounted to the substrate toward the front edge and in-line with the solid state drive array along a direction that extends from one opposing side edge to the other opposing side edge
Data Source
AI summary
A compute device for operation in a rack of a data center includes a substrate, a solid state drive array, a fan array, and a plurality of physical resources. The components of the compute device are arranged on the substrate to prevent or reduce shadowing of heat-producing physical resources, such as a processor, by other heat-producing physical resources relative to an airflow generated by the fan array. To do so, ruler solid state drives are used to facilitate positioning of the fan array toward a front edge of the substrate.