Electroless Ruthenium Plating Bath Stabilizer

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Solution Overview

Problem

Ruthenium has poor deposition properties due to its multiple valences, and existing electroless plating baths using sodium borohydroxide as a reducing agent face stability issues and pattern decomposition problems.

Innovation Solution

An electroless ruthenium plating bath containing a ruthenium compound, a reducing agent such as amine borane or sodium hypophosphite, and a stabilizer combination of hydroxylamine and amine compounds to improve bath stability and deposition properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If sodium borohydroxide is used as a reducing agent, then ruthenium deposition can be achieved, but bath stability deteriorates and pattern decomposition occurs

Engineering Contradiction:

Improveruthenium deposition propertyVSAvoidbath stability

Core Design Contradiction:

Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The patent changes the chemical parameters of the plating bath by replacing sodium borohydroxide with alternative reducing agents (amine borane compounds or sodium hypophosphite) and adjusting the stabilizer composition (hydroxylamine compound + amine compound). This parameter change resolves the contradiction by achieving Ruthenium deposition while maintaining bath stability and preventing pattern decomposition.

Inventive Principle:

Principle #35Parameter changes

2Manufacturing precision

If bath stability is increased to prevent decomposition, then deposition uniformity improves, but deposition rate decreases

Engineering Contradiction:

Improvedeposition uniformityVSAvoiddeposition rate

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent optimizes the balance between stability and deposition rate by carefully controlling the concentrations of the reducing agent and stabilizer. The specific parameter changes in the bath composition enable simultaneous achievement of uniform deposition and adequate deposition rate, resolving the contradiction between these two requirements.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances bath stability and ruthenium deposition properties, ensuring uniform deposition even in fine areas, and prevents excessive bath stability that can hinder deposition.

Implementation Method 1

The reducing agent is at least one of an amine borane compound or sodium hypophosphite

Methodology Applied

Scientific EffectChemical reduction: Reduction

Implementation Method 2

The stabilizer is made of a hydroxylamine compound and an amine compound

Methodology Applied

Scientific EffectChemical stabilization:

Implementation Method 3

an electroless ruthenium plating bath containing a ruthenium compound, a reducing agent, and a stabilizer

Methodology Applied

Scientific EffectElectroless plating:

Data Source

PatentUS20240218518A1Electroless ruthenium plating bath

Publication Date: 2024.07.04 C UYEMURA & CO LTD

AI summary

An electroless ruthenium plating bath at least contains: a ruthenium compound; a reducing agent; and a stabilizer. The reducing agent is at least one of an amine borane compound or sodium hypophosphite. The stabilizer is made of a hydroxylamine compound and an amine compound. The hydroxylamine compound is at least one of hydroxylamine sulfate or hydroxylamine chloride.