S-Shaped Heat Pipe Base Thermal Contact Area
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Solution Overview
Problem
Conventional heat dissipation devices with straight heat pipes have a limited thermal contact area, leading to inefficient heat distribution from the center to other parts of the base, resulting in inadequate heat dissipation capacity for high-power electronic devices.
Innovation Solution
The heat dissipation device incorporates S-shaped or M-shaped first heat pipes and U-shaped second heat pipes that cover most of the base's surface, providing a larger thermal contact area and allowing for even heat distribution from the electronic device to the fins for ambient air dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a straight heat pipe is used, then the structure is simple, but the thermal contact area between the base and the heat pipe is small, resulting in poor heat distribution
Solution Approach 1:
The patent applies curvature by transforming the straight heat pipe into an S-shaped configuration. This curved design allows the heat pipe to conform to the base surface more effectively, increasing the thermal contact area from a limited linear contact to an extended curved contact that follows the base contours, thereby improving heat distribution without requiring complex multi-component structures
Solution Approach 2:
The patent transitions from a one-dimensional straight heat pipe to a two-dimensional S-shaped heat pipe that spreads across the base surface. This dimensional expansion allows the heat pipe to cover a larger area of the base, creating multiple contact zones that improve thermal coupling and heat distribution efficiency while maintaining structural simplicity
2Power
If conventional heat dissipation devices are used, then the structure is simple, but the heat dissipation capacity is insufficient for high-power CPUs
Solution Approach 1:
The patent segments the heat dissipation function by dividing the single straight heat pipe into multiple S-shaped heat pipe sections arranged in parallel on the base. Each S-shaped section acts as an independent heat transfer pathway, collectively providing enhanced heat dissipation capacity for high-power CPUs while maintaining relative structural simplicity through modular arrangement
Solution Approach 2:
The patent merges multiple S-shaped heat pipe configurations with the base and fin array to create an integrated heat dissipation system. The combined effect of multiple curved heat pipes working in parallel with the extended fin surface area provides superior heat dissipation capacity compared to conventional single heat pipe designs, addressing the power dissipation requirements of modern high-performance processors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly enhances the heat dissipation capacity by ensuring rapid and uniform heat distribution across the base, improving the device's ability to manage heat generated by high-power electronic devices.
Implementation Method 1
The heat pipe is thermally combined to the base... The heat in the base is absorbed by the heat pipe, and the heat pipe transfers the heat from the center to other parts of the base
Implementation Method 2
a heat pipe thermally combined to the base, and a plurality of fins arranged on the base. Generally, the heat pipe is linear. The base defines a corresponding groove substantially in a center thereof receiving the heat pipe therein
Implementation Method 3
The heat in the base spreads to the fins to be dissipated to ambient air
Implementation Method 4
the heat in the base spreads to the fins to be dissipated to ambient air
Data Source
AI summary
A heat dissipation device includes a base for contacting an electronic device, a fin set located on the base and first, second heat pipes thermally engaged in the base. The first heat pipe comprises a first transferring portion and two second transferring portions extending from two opposite free ends of the first transferring portion. The second heat pipe has first and second transferring sections. The first transferring section of the second heat pipe is located adjacent to the first transferring portion of the first heat pipe and between the first transferring portion and one of the second transferring portions of the first heat pipe, and the second transferring section of the second heat pipe is located adjacent to the one of the second transferring portions of the first heat pipe.