Manufacturing package by solderable or sinterable metallic connection structure applied on sacrificial carrier
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Solution Overview
Problem
Conventional electronic package manufacturing methods are inefficient and lack a simple way to achieve high performance and compact design, as they often require complex processes and additional carriers that hinder electrical and mechanical coupling with electronic peripheries.
Innovation Solution
A method involving a metallic connection structure with solder or sinter material applied to a sacrificial carrier, where an electronic component is mounted and encapsulated, followed by removal of the carrier to expose the metallic connection structure, forming an intermetallic compound that facilitates electrical and mechanical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a conventional chip carrier is used to support the metallic connection structure, then the structural stability is improved, but the package dimensions and complexity increase
Solution Approach 1:
The patent removes the permanent carrier from the final package structure by using a sacrificial carrier that is temporarily present during manufacturing but is completely removed after the metallic connection structure is formed and the electronic component is mounted. This extraction of the unnecessary carrier component achieves compact package dimensions while maintaining structural stability through the formed intermetallic compounds.
Solution Approach 2:
The sacrificial carrier is discarded after serving its temporary purpose of supporting the metallic connection structure during assembly. The carrier is designed to be removed after the intermetallic compounds are formed, which then provide the necessary structural support without the carrier present. This discarding approach eliminates the need for permanent carrier structures.
2Volume of moving object
If a sacrificial carrier is removed after encapsulation, then the package compactness is improved, but the manufacturing process complexity increases
Solution Approach 1:
The intermetallic compound formation is performed as a preliminary action before carrier removal. By forming the intermetallic compounds while the sacrificial carrier is still in place, the patent ensures that the connection structure is fully established and stable before the carrier is discarded. This preliminary formation of bonding interfaces simplifies the overall process by ensuring all critical bonding operations are complete before the complex carrier removal step.
Solution Approach 2:
The sacrificial carrier serves as an intermediary element during manufacturing, providing temporary support and enabling the formation of metallic connection structures. The carrier mediates between the manufacturing requirements (needing support during assembly) and the final package requirements (no carrier for compactness). Its temporary presence simplifies the manufacturing process by providing a workable substrate during assembly operations.
3Reliability
If an intermetallic compound is formed at the interface, then the electrical and mechanical connection reliability is improved, but the manufacturing process time increases
Solution Approach 1:
The patent merges multiple functions into the intermetallic compound formation step: it creates the electrical connection interface, establishes mechanical bonding strength, and simultaneously prepares the surface for subsequent encapsulation. By combining these functions into a single integrated process step performed at elevated temperature, the patent achieves high connection reliability without adding separate sequential steps that would increase manufacturing time.
Solution Approach 2:
The formation of intermetallic compounds utilizes parameter changes, specifically temperature elevation during a reflow or sintering process. By changing the temperature parameter to enable intermetallic formation, the patent achieves reliable electrical and mechanical connections in a single thermal processing step that can be integrated into existing manufacturing workflows, minimizing additional process time.
4Ease of operation
If the metallic connection structure is exposed by removing the carrier, then the ease of coupling with electronic periphery is improved, but the structural support during manufacturing is reduced
Solution Approach 1:
The metallic connection structure is preliminarily formed and stabilized on the sacrificial carrier before carrier removal. The intermetallic compounds are formed while the carrier provides structural support, ensuring the connection structure is fully established and stable. Only after this preliminary formation is complete is the carrier removed, at which point the exposed metallic connection structure is already ready for coupling with electronic periphery.
Solution Approach 2:
The sacrificial carrier acts as an intermediary support structure during manufacturing, enabling the metallic connection structure to be formed and stabilized. The carrier mediates between the need for structural support during assembly and the need for exposed connection structures for coupling. By providing temporary support during critical formation operations and then being removed, the carrier enables both structural stability during manufacturing and ease of coupling in the final package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies package manufacturing, enables compact designs, and enhances electrical and mechanical reliability by forming an intermetallic compound that promotes connections with electronic peripheries, such as printed circuit boards.
Implementation Method 1
an intermetallic compound may be formed as an interface between the sacrificial carrier and the solderable or sinterable metallic connection structure
Implementation Method 2
a metallic connection structure, which comprises a solder or sinter material
Data Source
AI summary
A method of manufacturing a package is disclosed. In one example, the method comprises applying a metallic connection structure, which comprises a solder or sinter material, on a sacrificial carrier. An electronic component is mounted on the metallic connection structure. At least part of the electronic component and of the metallic connection structure is encapsulated. Thereafter, the sacrificial carrier is removed to thereby expose at least part of the metallic connection structure.