Sacrificial Contact Electrode for Semiconductor Probe Protection
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Solution Overview
Problem
Existing current applying devices for semiconductor inspection do not effectively protect the probe device from large currents, as the contact electrode is not designed to fail first and block the current in case of failure, potentially damaging the expensive and durable pressing body.
Innovation Solution
A current applying device is configured with a contact electrode and a pressing body that are serially connected, where the contact electrode is designed to fail first when a large current is applied, ensuring it blocks the current and protects the pressing body by having a higher power rating than the contact electrode, allowing the pressing body to maintain its lifespan without repair.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the contact electrode is designed to be durable and resistant to large currents, then the reliability of the current applying device is improved, but the cost and complexity of the device increases
Solution Approach 1:
The current applying device is segmented into two distinct functional components: a disposable contact electrode that handles current application and a reusable pressing body that provides mechanical pressure. This segmentation allows each component to be optimized independently - the contact electrode can be simple and sacrificial while the pressing body remains complex and durable.
Solution Approach 2:
The contact electrode is designed as a disposable, low-cost component that is intended to fail first in case of abnormal conditions. By making the contact electrode replaceable and inexpensive, the system protects the more expensive and complex pressing body from damage, resolving the contradiction between reliability and device complexity.
2Reliability
If the contact electrode is designed to fail first and block current in case of failure, then the pressing body is protected from damage, but the contact electrode must have higher power rating than the pressing body
Solution Approach 1:
The contact electrode is pre-configured with electrical connection structures (such as protrusions fitting into grooves) that establish electrical connectivity before the pressing operation begins. This preliminary electrical connection ensures that when abnormal current conditions occur, the contact electrode is already in position to fail first and block the current, protecting the pressing body.
Solution Approach 2:
The contact electrode serves as an intermediary component between the current source and the pressing body. It mediates the electrical connection while being designed to fail first, thus protecting the pressing body from direct exposure to harmful large currents. The structural design with protrusions and grooves ensures proper electrical connection through this intermediary component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The contact electrode fails first when a large current is applied, effectively blocking the current and preventing damage to the pressing body, thus extending the lifespan of the pressing body assembly without the need for repair.
Implementation Method 1
a coil spring which exerts a force on the plunger so as to allow the contact body to be in contact with the semiconductor
Implementation Method 2
the contact portion of the contact member is oscillated like a seesaw with respect to the inner peripheral edge of the depression as a supporting point when the contact portion is in contact with the semiconductor
Implementation Method 3
a center region of the contact member is fixed to the plunger by a fastener which is inserted into a fastener insertion hole in a depression of the extremity surface of the plunger
Data Source
AI summary
A current applying device in which a contact electrode is destroyed firstly when a large current is applied in the event of failure. A probe device is configured by serially connecting a contact body that is to be in contact with the surface of a power semiconductor to apply a current and a pressing body assembly that presses the contact body so as to apply the current to the power semiconductor and is configured so that, when the pressing body power applied to the pressing body assembly is smaller than the withstand power of the pressing body assembly, the contact body power applied to the contact body is larger than the withstand power of the contact.