Sacrificial Disk Support for Wafer Breakage During Ingot Slicing

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Solution Overview

Problem

Wafer breakage during the wire saw operation in slicing monocrystalline semiconductor ingots reduces the yield and increases manufacturing inefficiencies and costs.

Innovation Solution

The use of sacrificial disks positioned adjacent the longitudinal end faces of the ingot provides longitudinal support to inhibit uncontrolled breakage of wafers during slicing, using semiconductor materials like single crystal silicon that are compatible with the slurry and can be recycled.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If wafers are sliced from the longitudinal end faces of the ingot, then the number of wafers produced increases, but uncontrolled wafer breakage occurs due to stresses along weak crystal planes

Engineering Contradiction:

Improvenumber of wafers producedVSAvoidwafer integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

A support structure (sacrificial disk or extended bond beam) is introduced as an intermediary element between the wire saw and the longitudinal end wafers. This intermediary provides mechanical support to the vulnerable end wafers during slicing, distributing the cutting stresses and preventing uncontrolled breakage while allowing the slicing operation to proceed through the entire ingot length

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The support structure is positioned in advance before the slicing operation begins, providing pre-positioned mechanical support to the longitudinal end wafers. This beforehand cushioning compensates for the inherent weakness of end wafers subject to cutting stresses, allowing them to withstand the slicing forces without breaking

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Productivity

If the wire saw process is applied to slice the entire ingot, then manufacturing efficiency increases, but wafer breakage reduces yield and increases costs

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidwafer yield

Core Design Contradiction:

ProductivityVSLoss of substance

Solution Approach 1:

The support structure (sacrificial disk) is designed to be consumed or damaged during the slicing process, converting its potential harm (being in the slicing path) into a benefit (providing support to end wafers). The sacrificial disk absorbs cutting stresses and potential damage that would otherwise transfer to the valuable longitudinal end wafers, thereby protecting the wafer yield while maintaining manufacturing efficiency

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Data Source

PatentUS12617032B2Systems and methods for controlling wafer breakage during ingot slicing operations

Publication Date: 2026.05.05 GLOBALWAFERS CO LTD

AI summary

A system for slicing wafers from a monocrystalline semiconductor ingot includes a wire saw, a bond beam, the monocrystalline semiconductor ingot, and two sacrificial disks. The wire saw includes a wire web and wire guides operable to drive the wire web during a slicing operation. The bond beam is connected to the wire saw. The wire saw is operable to move the bond beam in a movement direction towards the wire web during the slicing operation to slice the wafers from the ingot. The ingot includes longitudinal end faces and a circumferential edge extending between the longitudinal end faces. The ingot is attached to the bond beam along the circumferential edge. One sacrificial disk is positioned adjacent each of the longitudinal end faces of the ingot to inhibit uncontrolled breakage of the wafers during the slicing operation.