Sacrificial Pattern Layer for LED Alignment
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Solution Overview
Problem
The yield rate of light-emitting apparatuses is hindered by the difficulty in accurately aligning light-emitting diode elements, pads, and interconnection layers during the manufacturing process.
Innovation Solution
A light-emitting apparatus and manufacturing method that include a substrate with pads, a sacrificial pattern layer, and connection patterns made of hot fluidity conductive materials, where the connection patterns flow and connect to pads and electrodes, reducing alignment requirements through the formation of gaps and a heating process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If accurate alignment of light-emitting diode elements, pads, and interconnection layer is required, then electrical connection reliability is improved, but manufacturing complexity and difficulty increase
Solution Approach 1:
The patent introduces a sacrificial pattern layer as an intermediary element between the light-emitting diode element and the pad. This sacrificial layer serves as a temporary alignment reference during the bonding process, allowing the LED element to be positioned accurately without requiring complex alignment systems. After bonding, the sacrificial layer is removed, having fulfilled its mediating function in the alignment process.
Solution Approach 2:
The sacrificial pattern layer is formed in advance on the substrate before the light-emitting diode element is transferred. This preliminary structure provides pre-established alignment references that guide the positioning of the LED element and its electrodes to the correct locations on the substrate and pads, eliminating the need for complex real-time alignment during the bonding process.
2Manufacturing precision
If strict alignment between light-emitting diode elements and pads is enforced, then connection precision is improved, but manufacturing yield decreases
Solution Approach 1:
The sacrificial pattern layer acts as a tolerant intermediary that absorbs alignment variations. By providing physical reference structures (the sacrificial patterns) that are easier to align with than the actual functional components, the system achieves acceptable connection precision without requiring extremely tight alignment tolerances, thereby maintaining high manufacturing yield.
Solution Approach 2:
The patent changes the alignment reference from the functional components (LED elements and pads) to the sacrificial patterns, which have different dimensional parameters and tolerance characteristics. This parameter change allows for relaxed alignment requirements while still achieving the necessary connection precision, as the sacrificial patterns can be designed with larger feature sizes and greater tolerance margins.
3Measurement precision
If complex alignment processes are used to ensure proper connection, then connection accuracy is improved, but manufacturing time and cost increase
Solution Approach 1:
The sacrificial pattern layer and its alignment reference structures are prepared in advance during the substrate fabrication process. This preliminary preparation eliminates the need for complex alignment measurements and adjustments during the subsequent LED element transfer and bonding steps, significantly reducing the manufacturing cycle time while maintaining high alignment accuracy.
Solution Approach 2:
The sacrificial patterns serve as intermediate alignment markers that simplify the measurement and alignment process. Instead of directly aligning the small, critical LED elements and pads with high precision, the process uses the larger, easier-to-measure sacrificial patterns as intermediaries, reducing the time and complexity of alignment operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves the yield rate of light-emitting apparatuses by simplifying the alignment process and ensuring reliable electrical connections between light-emitting diode elements and the substrate.
Implementation Method 1
the material of the plurality of connection patterns includes a hot fluidity conductive material
Implementation Method 2
performing a heating process to make the plurality of connection patterns to flow
Data Source
AI summary
A light-emitting apparatus includes a substrate, pads disposed on the substrate, a sacrificial pattern layer and a light-emitting diode element disposed on the sacrificial pattern layer. The light-emitting diode element includes a first type semiconductor layer, a second type semiconductor layer, an active layer, and electrodes. A connection patterns disposed on at least one of the electrodes and the pads. Materials of the connection patterns include hot fluidity conductive materials. The connection patterns cover a sidewall of the sacrificial pattern layer and are electrically connected to the at least one of the electrodes and the pads. In addition, the manufacturing method of the above light-emitting apparatus is also proposed.