SAM-Assisted Metallization for Flexible PCB Footprints

Solution Overview

Problem

The challenge in electronic device manufacturing is the lack of flexibility in design cycles, where changes or variations, such as different sensor configurations, are difficult to implement without resulting in unused areas on the board and potential signal integrity issues due to open lines in unused footprint regions.

Innovation Solution

The use of a self-assembled monolayer (SAM) assisted structuring process allows for late binding of metallization structures on a substrate, enabling the formation of conductive traces and pads after initial device formation, thereby optimizing space usage and reducing signal interference by allowing for flexible configuration of sensor and antenna components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple footprints are provided on substrate for different components, then adaptability is improved, but area is wasted and signal integrity deteriorates due to open lines in unused regions

Engineering Contradiction:

ImproveadaptabilityVSAvoidarea

Core Design Contradiction:

Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The patent applies preliminary action by pre-forming trace structures on the substrate before final component assembly. These traces are initially formed in a non-conductive state or as open circuits, allowing multiple footprint configurations to be prepared in advance without creating harmful open-line effects until actually needed. This enables adaptability while avoiding the area waste and signal integrity issues of traditional unused footprint regions.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent implements dynamics by making the footprint configuration changeable after substrate fabrication. The trace structures can be selectively activated or deactivated based on which component is ultimately installed, allowing the board layout to dynamically adapt to different component selections without wasting space or creating signal interference from permanently unused regions.

Inventive Principle:

Principle #15Dynamics

2Adaptability or versatility

If multiple footprints are provided on substrate for different components, then adaptability is improved, but signal integrity deteriorates due to open lines in unused footprint regions

Engineering Contradiction:

ImproveadaptabilityVSAvoidsignal integrity

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent applies preliminary action by pre-forming trace structures on the substrate before final component assembly. These traces are initially formed in a non-conductive state or as open circuits, allowing multiple footprint configurations to be prepared in advance without creating harmful open-line effects until actually needed. This enables adaptability while avoiding the area waste and signal integrity issues of traditional unused footprint regions.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent converts the potential harm of open lines into a benefit by designing the trace structures to be non-conductive or isolated by default in unused regions. Rather than allowing open lines to cause signal integrity issues, the traces are configured to remain inactive until a component is installed, thereby eliminating the harmful effect while preserving adaptability.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Adaptability or versatility

If late binding of metallization structures is performed, then adaptability is improved and area is optimized, but manufacturing complexity increases

Engineering Contradiction:

ImproveadaptabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by pre-forming trace structures on the substrate before final component assembly. These traces are initially formed in a non-conductive state or as open circuits, allowing multiple footprint configurations to be prepared in advance without creating harmful open-line effects until actually needed. This enables adaptability while avoiding the area waste and signal integrity issues of traditional unused footprint regions.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables early device fabrication with flexibility in final routing and footprint formation, saving space and improving signal quality by allowing for late formation of conductive structures, thus accommodating various sensor and antenna configurations without wasting board real estate or causing signal interference.

Implementation Method 1

performing self-assembled monolayer (SAM) assisted structuring to form a structure comprising a metal on the dielectric surface region

Methodology Applied

Scientific EffectSelf-assembled monolayer formation: Self-Assembly

Data Source

PatentUS10734236B2Electronic devices with components formed by late binding using self-assembled monolayers

Publication Date: 2020.08.04 INTEL CORP

AI summary

Embodiments include devices and methods, including a method for processing a substrate. The method includes providing a substrate including a first portion and a second portion, the first portion including a feature, the feature including an electrically conductive region, the second portion including a dielectric surface region. The method also includes performing self-assembled monolayer (SAM) assisted structuring plating to form a structure comprising a metal on the dielectric surface region, the feature being formed using a process other than the SAM assisted structuring plating used to form the structure, and the structure being formed after the feature. Other embodiments are described and claimed.