SAM-Integrated Photoresist Stripper for Organic Electronics
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Solution Overview
Problem
Current processes for forming electronic devices, such as organic electronic devices, involve complex and costly steps for depositing self-assembled monolayers (SAMs) on conductive layers, which increase the work function and affect charge injection, and require multiple tools and additional process steps.
Innovation Solution
A photoresist stripper mixture comprising a self-assembled monolayer material and a glycol component, such as pentafluorobenzenethiol, is used to dissolve photoresist and deposit a SAM on the electronic device surfaces during the photolithography process, reducing the number of steps and improving charge injection properties by integrating SAM deposition with photoresist removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate processes are used for photoresist removal and SAM deposition, then each process can be optimized independently, but the overall process complexity and cost increase due to multiple tools and steps
Solution Approach 1:
The patent combines photoresist removal and SAM deposition into a single integrated process step. The photoresist stripper mixture contains both the stripper chemicals and SAM precursor molecules, allowing simultaneous removal of photoresist and deposition of SAM on the conductive layer during one treatment cycle, thereby reducing process complexity while maintaining optimization benefits
Solution Approach 2:
The photoresist stripper mixture serves multiple functions: it acts as a photoresist dissolving agent, a solvent for SAM precursors, and a delivery vehicle for SAM deposition. This multi-functional approach eliminates the need for separate tools and processes, reducing overall system complexity while preserving the ability to optimize each function independently through mixture formulation
2Reliability
If multiple process steps are used for photoresist removal and SAM deposition, then each step can be controlled separately, but the production time and cost increase
Solution Approach 1:
By merging photoresist removal and SAM deposition into a single process step using a combined stripper mixture, the patent reduces the total number of process steps and production time, while maintaining separate control mechanisms through the formulation of the mixture components and their respective concentrations
Solution Approach 2:
The SAM precursor is pre-mixed with the photoresist stripper chemicals before the process begins. This preliminary preparation ensures that when the mixture is applied, both photoresist removal and SAM deposition occur simultaneously without requiring separate setup or control steps, improving production efficiency while maintaining process control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the process by combining photoresist removal and SAM deposition, reducing process complexity and costs, while enhancing the work function of conductive layers and improving charge injection and film morphology.
Implementation Method 1
photoresist stripper for dissolving photoresist
Implementation Method 2
depositing a self-assembled monolayer on said at least one surface of said electronic device
Data Source
AI summary
A process of forming an electronic device, by forming the source and drain contacts using photolithography, incorporating a self-assembled monolayer (SAM) over the electrical contacts to form an increased work function of the source and drain electrodes and further forming more favorable charge injection properties or within the channel region to improve film morphology and therefore improve charge transport. The SAM material is added to the photoresist stripper during a step of the photolithography process of forming electrical contacts.