Sample Gripping and Heating Assembly for Adhesive-Free Mechanical Testing
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Solution Overview
Problem
Existing mechanical testing methods at micron or nano scales face challenges with sample fracture along seams or interfaces due to adhesive limitations, which restrict the application of elevated tensile forces and are prone to adhesive bond failure under heating.
Innovation Solution
A sample gripping and heating assembly that applies compressive force to a substrate, eliminating the need for adhesives by integrating heating elements within the gripping surfaces to heat the sample directly, thereby avoiding heat transfer from remote locations and minimizing mechanical property deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesives are used to mount samples for mechanical testing, then samples can be securely held, but adhesive bond failure occurs under elevated tensile forces and heating conditions
Solution Approach 1:
The patent removes the adhesive layer from the sample mounting system entirely. Instead of using adhesives to bond the sample to the substrate, the system uses a mechanical gripping interface where the gripper directly engages with the sample substrate through friction and normal force, eliminating the adhesive bond failure mode completely
Solution Approach 2:
The patent replaces the chemical bonding mechanism (adhesive) with a mechanical gripping mechanism. The gripper applies normal force to the sample substrate, creating friction-based holding without any adhesive material, thus substituting chemical bonding with mechanical interaction
2Temperature
If heating elements are positioned at remote locations, then sample heating can be achieved, but heat transfer causes mechanical property deformation
Solution Approach 1:
The patent places heating elements in direct thermal contact with the sample at the gripping interface location. This localized heating approach ensures that heat is applied precisely where needed (at the sample-gripper interface) rather than from remote locations, minimizing thermal gradients and preventing deformation of mechanical properties through uneven heating
Solution Approach 2:
The gripping surfaces serve as an intermediary thermal pathway. The heating elements are embedded in or attached to the gripper surfaces, which then conduct heat directly to the sample at the interface point, providing controlled local heating without requiring remote heat sources
3Stability of the object's composition
If adhesives are used for sample mounting, then sample fixation is achieved, but sample fracture occurs along adhesive interfaces
Solution Approach 1:
The patent eliminates the adhesive layer that creates fracture interfaces. By removing adhesives entirely and using direct mechanical gripping, there is no adhesive-sample interface where fractures can initiate and propagate, thus preventing sample failure along adhesive boundaries
Solution Approach 2:
The patent creates a direct mechanical interface between the gripper and sample substrate that replicates the function of adhesive bonding (secure fixation) without using adhesives. The friction-based mechanical grip provides equivalent or superior fixation stability while maintaining sample integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable tensile mechanical testing without adhesive interfaces, allowing for higher tensile loading and precise temperature control, reducing the risk of sample failure and maintaining accurate mechanical property measurement.
Implementation Method 1
integrating heating elements within the gripping surfaces to heat the sample directly
Implementation Method 2
A sample gripping and heating assembly that applies compressive force to a substrate
Implementation Method 3
heating elements within the gripping surfaces to heat the sample directly, thereby avoiding heat transfer from remote locations
Data Source
Figure 1~2
Figure 3A~4B
Figure 4C~5C
AI summary
A sample gripping and heating assembly includes an assembly housing and first and second heating grips coupled with the assembly housing. The first and second heating grips each include a gripping surface, and the gripping surfaces of the first and second heating grips are opposed to each other. Each of the first and second heating grips further includes a heating element adjacent to the gripping surface. Optionally, the sample gripping and heating assembly is included in a heating system including a probe heater having a probe heating element for heating of a probe. The heating system is included with a testing assembly having a stage coupled with the sample gripping and heating assembly, and a transducer assembly coupled with the probe heater.