Sample Holder Structure for Uniform Heating and Low Warpage
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Solution Overview
Problem
Existing sample holders experience non-uniform heat transfer and deformation due to differences in thermal expansion between ceramic plates and cooling members, leading to impaired in-plane thermal uniformity and potential warpage during plasma treatment.
Innovation Solution
A sample holder design featuring a heat-resistant member with a lower thermal expansion coefficient than the ceramic plate, positioned between the ceramic plate and the base member without direct bonding, and optionally using a bonding material and protruding portions or coating layers to enhance sliding and heat transfer, reducing thermal stress and improving in-plane thermal uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a composite material with coefficient of thermal expansion close to ceramic plate is bonded between ceramic plate and cooling member, then thermal stress is reduced, but in-plane thermal uniformity is impaired due to non-uniform heat transfer
Solution Approach 1:
The invention removes the composite material layer that was previously bonded between the ceramic plate and cooling member. By extracting this intermediate layer, the patent eliminates the source of non-uniform heat transfer while still managing thermal stress through direct contact design and geometric optimization of the ceramic plate and cooling member interfaces.
Solution Approach 2:
The invention introduces a heat-resistant member as an intermediary between the ceramic plate and cooling member. This mediator has different thermal expansion characteristics but provides more uniform heat transfer compared to the previous composite material, thereby improving in-plane thermal uniformity while managing thermal stress.
2Device complexity
If ceramic plate is directly bonded to cooling member, then structure is simplified, but thermal expansion difference causes warpage and non-uniform heat transfer
Solution Approach 1:
The heat-resistant member serves as an intermediary layer between the ceramic plate and cooling member. This intermediate component mediates the thermal expansion difference between the two materials while providing a stable interface for heat transfer, thereby improving in-plane thermal uniformity without significantly increasing structural complexity.
3Manufacturing precision
If heat-resistant member with lower thermal expansion coefficient is used and not bonded to ceramic plate, then in-plane thermal uniformity is improved, but thermal stress management becomes challenging
Solution Approach 1:
The heat-resistant member acts as a mediator that accommodates thermal expansion differences between the ceramic plate and cooling member. By selecting a material with lower thermal expansion coefficient and positioning it strategically, the design achieves uniform heat transfer while the material's inherent properties help manage thermal stress through controlled expansion behavior.
Solution Approach 2:
The invention changes the thermal expansion parameter of the intermediate layer by selecting a heat-resistant member with a lower coefficient of thermal expansion than the ceramic plate. This parameter change allows the system to better manage thermal stress while improving heat transfer uniformity across the sample holder surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances in-plane thermal uniformity and reduces warpage, ensuring consistent heat transfer and improved sample holding stability during high-temperature processes.
Implementation Method 1
The heat-resistant member has a coefficient of thermal expansion smaller than that of the ceramic plate
Data Source
AI summary
A sample holder includes a ceramic plate, a heat-resistant member, and a base member. The ceramic plate, the heat-resistant member, and the base member are located in this order. The heat-resistant member has a coefficient of thermal expansion smaller than that of the ceramic plate, and is not bonded to the ceramic plate.