Sample Lift-Out Attachment Using Sputter-Redeposition Bonding
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Solution Overview
Problem
Current charged particle microscopy systems face challenges in attaching and manipulating highly reactive samples due to contamination risks, complex processing steps, and potential sample degradation from traditional attachment methods using precursor gases or liquids.
Innovation Solution
The method involves using a high sputter yield material for the sample manipulator, which is milled using a charged particle beam to form an attachment bond with the sample without the need for additional deposition gases or liquids, allowing for the attachment of highly reactive materials without sample damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional precursor gases or liquids are used to attach samples to manipulators, then attachment bonds can be formed, but contamination of optical components and sample degradation occur
Solution Approach 1:
The patent removes the precursor gas or liquid step from the attachment process entirely. Instead, it uses a manipulator tip made of high sputter yield material that is directly milled by the charged particle beam to create attachment bonds with the sample, eliminating the source of contamination while maintaining reliable attachment.
Solution Approach 2:
The patent introduces a high sputter yield material (such as copper or aluminum) as an intermediary between the charged particle beam and the sample. This material serves as a mediator that can be milled to create attachment bonds without requiring precursor gases or liquids, thus avoiding contamination while enabling reliable attachment.
2Reliability
If precursor gases are introduced into the chamber to form attachment bonds, then samples can be attached to manipulators, but the system design becomes more complex and processing steps become harder to implement
Solution Approach 1:
The patent eliminates the need for precursor gas introduction mechanisms, liquid delivery systems, and associated control systems. The attachment process is simplified to using only the charged particle beam to mill the high sputter yield material on the manipulator tip, significantly reducing system complexity.
Solution Approach 2:
The high sputter yield material on the manipulator tip serves its dual purpose: it is both the structural material of the manipulator and the source material for creating attachment bonds. The charged particle beam automatically mills this material to form deposits that bond the sample, making the system self-sufficient without external precursor supplies.
3Adaptability or versatility
If traditional attachment methods are used, then general samples can be attached, but highly reactive samples suffer from surface degradation and increased reactivity
Solution Approach 1:
The high sputter yield material acts as a protective intermediary during the attachment process. It absorbs the charged particle beam's energy during milling, preventing direct damage to the highly reactive sample surface. The material is consumed in the process to form attachment bonds, shielding the sample from degradation.
Solution Approach 2:
The high sputter yield material creates a localized inert environment at the attachment site. By being milled and redeposited, it forms a protective layer that prevents direct interaction between the charged particle beam and the highly reactive sample, effectively creating a chemically inert zone during the attachment process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the attachment of highly reactive samples to a sample holder without introducing additional materials, reducing the risk of contamination and sample degradation, and simplifying the processing steps, thereby facilitating high-quality imaging and investigation of such materials.
Implementation Method 1
the high sputter yield material may be the material milled with the charged particle beam such that it is removed from the sample manipulator. According to the present disclosure, the portions of the sample manipulator are milled such that at least some of the removed high sputter yield material redeposits to form an attachment between the sample manipulator and the sample
Data Source
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AI summary
Methods and systems for creating attachments between a sample manipulator and a sample within a charged particle systems are disclosed herein. Methods include translating a sample manipulator so that it is proximate to a sample, and milling portions of the sample manipulator such that portions are removed. The portion of the sample manipulator proximate to the sample is composed of a high sputter yield material, and the high sputter yield material may be the material milled with the charged particle beam such that it is removed from the sample manipulator. According to the present disclosure, the portions of the sample manipulator are milled such that at least some of the removed high sputter yield material redeposits to form an attachment between the sample manipulator and the sample.