Sample Lift-Out Attachment by Sputter Redeposition for Reactive Materials
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Solution Overview
Problem
Current charged particle microscopy systems face challenges in attaching and manipulating highly reactive samples due to the introduction of precursor gases or liquids, which can cause sample degradation and contamination.
Innovation Solution
The method involves translating a sample manipulator proximate to the sample and milling high sputter yield material to create an attachment between the sample and the manipulator, without the need for additional deposition materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If precursor gas or liquid is introduced to attach sample to manipulator, then attachment is formed, but sample degradation and contamination occur
Solution Approach 1:
The patent removes the harmful precursor gas or liquid from the attachment process entirely. Instead, it uses a focused ion beam to directly sputter material from the manipulator surface, which then redeposits to form the attachment bond. This extraction of the harmful intermediate substance resolves the contradiction by achieving attachment without sample degradation.
Solution Approach 2:
The patent introduces a focused ion beam as an intermediary mechanism between the manipulator and sample. The ion beam serves as the mediating agent that transfers material from the manipulator to the sample interface, replacing the harmful precursor gas/liquid intermediary and eliminating the associated contamination and degradation issues.
2Strength
If precursor gas or liquid is introduced for attachment, then attachment is achieved, but system complexity increases
Solution Approach 1:
The patent extracts and eliminates the complex precursor gas delivery and liquid introduction systems from the charged particle microscopy system. By using only the focused ion beam for material transfer, the system removes unnecessary mechanical components, valves, and fluid handling mechanisms, thereby reducing overall system complexity.
Solution Approach 2:
The patent makes the focused ion beam serve multiple functions: it mills the manipulator surface, transfers material through sputtering, and forms the attachment bond. This multi-functionality eliminates the need for separate attachment mechanism components, simplifying the overall system architecture.
3Strength
If precursor gas or liquid is introduced for attachment, then attachment is formed, but processing complexity increases
Solution Approach 1:
The patent removes the complex multi-step processing required for precursor gas introduction and liquid application. The attachment process is reduced to a single continuous ion beam operation where material is sputtered and redeposits to form the bond, eliminating the need for separate deposition, curing, or drying steps.
Solution Approach 2:
The patent implements a continuous attachment process where the focused ion beam continuously sputters material from the manipulator and the material continuously redeposits to form the attachment bond. This continuous action eliminates the intermittent steps required in gas/liquid methods (introduction, deposition, curing, removal), simplifying the overall processing procedure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the attachment of highly reactive materials without sample degradation, reduces contamination, and simplifies the process by eliminating the need for precursor gases or liquids.
Implementation Method 1
milling portions of the sample manipulator such that material that is removed via the milling redeposits to form an attachment between the sample manipulator and the sample
Implementation Method 2
at least some of the removed high sputter yield material redeposits to form an attachment between the sample manipulator and the sample
Data Source
AI summary
Methods and systems for creating attachments between a sample manipulator and a sample within a charged particle systems are disclosed herein. Methods include translating a sample manipulator so that it is proximate to a sample, and milling portions of the sample manipulator such that portions are removed. The portion of the sample manipulator proximate to the sample is composed of a high sputter yield material, and the high sputter yield material may be the material milled with the charged particle beam such that it is removed from the sample manipulator. According to the present disclosure, the portions of the sample manipulator are milled such that at least some of the removed high sputter yield material redeposits to form an attachment between the sample manipulator and the sample.


