Sample Processing Assembly Air Gap Mounting Surface
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Solution Overview
Problem
Existing automated sample processing systems face issues with substrates migrating or becoming stuck on the mounting surface, particularly when a heater is used, which interferes with the formation of a reaction chamber and makes substrate removal difficult.
Innovation Solution
A sample processing assembly with a mounting surface featuring a step to create an air gap between the substrate and the surface, allowing for reduced contact and preventing substrate migration, and a cover member that can be moved to form a reaction chamber, with guides to ensure precise alignment and a heater for temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the substrate is placed directly on the mounting surface to ensure good thermal contact for heating, then heat transfer efficiency is improved, but the substrate becomes stuck to the mounting surface making removal difficult
Solution Approach 1:
The mounting surface is segmented into two distinct levels: a first surface for thermal contact and a second surface elevated by a step. This segmentation allows the substrate to contact only the first surface for heating while being elevated above the second surface, preventing sticking and enabling easy removal.
Solution Approach 2:
Different regions of the mounting surface are given different properties: the first surface (at lower elevation) provides thermal contact for efficient heating, while the second surface (at higher elevation) provides a non-sticking surface for easy substrate removal. The step creates local quality differences in the mounting surface.
2Ease of operation
If the substrate is allowed to move freely on the mounting surface for easy placement, then ease of operation is improved, but the substrate may migrate and interfere with reaction chamber formation
Solution Approach 1:
The step structure creates preliminary resistance to substrate movement in the vertical direction by elevating the substrate above the second surface. This preliminary anti-action prevents the substrate from migrating horizontally and interfering with reaction chamber formation, while still allowing easy placement.
3Device complexity
If the mounting surface is made flat and continuous for simple structure, then device complexity is reduced, but substrate migration and sticking problems occur
Solution Approach 1:
The mounting surface is segmented into two levels connected by a step, creating distinct functional zones. This simple segmentation provides substrate stability by preventing both migration and sticking, without significantly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The air gap prevents substrate migration and sticking, facilitating easier substrate placement and removal while maintaining effective heat transfer for processing, ensuring precise and efficient sample processing.
Implementation Method 1
the mounting surface provides for an air gap between the substrate and the mounting surface
Implementation Method 2
when the mounting surface is in communication with a heater, making it difficult for the substrate to be removed
Data Source
AI summary
A sample processing assembly for treatment of a sample on a substrate, the assembly including: a mounting surface for the substrate; and a cover member, the cover member being movable between an open position and a substantially closed position, wherein, when the substrate is placed in the assembly and the cover member is in the substantially closed position, a reaction chamber is formed for processing the sample between the cover member and the substrate, and wherein the mounting surface provides for an air gap between the substrate and the mounting surface. An instrument for treatment of a sample on a substrate including at least one sample processing assembly as provided herein. A method of placing a substrate in a sample processing assembly is also provided.