Sample Source with Particle Beam Channel for TEM Handling

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Solution Overview

Problem

Current methods for preparing samples for transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) require fragile and costly equipment for handling small, thin samples, which can be damaged during testing and require specialized tools for sample preparation and handling.

Innovation Solution

A method and sample configuration where a particle beam channel is formed inside a sample source, allowing for the conductance of a particle beam to or from an inner side of the sample, which includes an area of interest, enabling the creation of a thicker sample that can be handled using standard tools and eliminating the need for specialized handling equipment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a thin sample (less than 200 nanometers thick) is used for transmission electron microscopy, then the electron signal can be transmitted through the sample for imaging, but the sample becomes extremely fragile and requires specialized handling equipment

Engineering Contradiction:
Improvemicrostructure imaging capabilityVSAvoidsample fragility
Core Design Contradiction:
Measurement precisionVSStrength

Solution Approach 1:

The thin sample is nested within a thicker sample source structure. The sample source includes a first portion with the thin sample and a second portion extending from the first portion, creating a nested configuration where the fragile thin sample is supported by the more robust thicker structure.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The thicker second portion of the sample source acts as an intermediary between the fragile thin sample and the handling equipment. This intermediary structure provides mechanical support and enables handling with standard tools without directly contacting the fragile thin sample region.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If specialized handling equipment is used for thin samples, then the sample can be handled without damage, but the equipment cost and complexity increase

Engineering Contradiction:
Improvesample handling safetyVSAvoidhandling equipment complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The thicker second portion of the sample source serves as an intermediary that enables the use of standard, simple handling tools. Instead of requiring complex specialized equipment to handle the thin sample directly, the robust second portion can be gripped and manipulated with conventional tools.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The design effectively creates a disposable or replaceable sample source structure where the thicker second portion can be easily manufactured and replaced if needed, avoiding the need for expensive, complex, and specialized handling equipment.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

3Ease of operation

If the sample is made thicker to enable standard tool handling, then the sample becomes easier to handle, but the electron transmission capability is reduced

Engineering Contradiction:
Improvehandling easeVSAvoidelectron transmission capability
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

The sample source is segmented into two distinct portions: a first portion containing the thin sample region optimized for electron transmission, and a second portion providing thickness for mechanical strength and ease of handling. This segmentation allows each portion to be optimized for its specific function.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the sample source have different local qualities: the first portion has thin dimensions optimized for electron transmission and imaging, while the second portion has greater thickness optimized for mechanical strength and ease of handling with standard tools.

Inventive Principle:
Principle #3Local quality

4Ease of operation

If additional secondary electron generators or detectors are added to handle thicker samples, then the sample can be analyzed with standard tools, but the device complexity and cost increase

Engineering Contradiction:
Improvetool standardizationVSAvoidequipment components
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The thicker sample source design enables the use of standard, universal handling tools already present in conventional microscopy systems. The sample source structure itself provides the necessary mechanical properties, eliminating the need for specialized handling equipment or additional generators and detectors.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the preparation of STEM samples that are less fragile and can be handled using standard wafer handling tools, reducing the risk of damage and the need for costly equipment, while enabling the generation of detailed microstructure images without requiring additional secondary electron generators or detectors.

Implementation Method 1

a particle beam channel formed inside the sample source for conducting a particle beam to or from the inner side of the sample

Methodology Applied
Scientific EffectElectron beam transmission: Electron Beam

Data Source

PatentUS7429733B2Method and sample for radiation microscopy including a particle beam channel formed in the sample source
Publication Date: 2008.09.30 BELL SEMICONDUCTOR LLC
  • US7429733B2 patent drawing
  • US7429733B2 patent drawing
  • US7429733B2 patent drawing

AI summary

A method and sample for radiation microscopy include a sample source that includes an area of interest, an outer side of a sample formed in the sample source adjacent to the area of interest, an inner side of the sample formed inside the sample source wherein at least a portion of the area of interest is included between the inner side of the sample and the outer side, and a particle beam channel formed inside the sample source for conducting a particle beam to or from the inner side of the sample.