Sample Storage Device Sidewall Molding via Pattern Forming Mold
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Solution Overview
Problem
Conventional sample storage devices face manufacturing complexities and high costs due to the need for separate substrates and adhesives, making large-scale production inefficient and time-consuming.
Innovation Solution
A method involving a pattern forming mold with an engraved pattern part to form a charging chamber sidewall on one substrate, followed by adhering a second substrate using UV curable resin and UV curing, allowing for efficient and cost-effective mass production of sample storage devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional separate substrates and adhesives are used to form sample storage devices, then the devices can be assembled, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The patent combines the substrate and sidewall formation into a single integrated structure. The mold directly forms both the substrate and the raised sidewalls in one molding operation, eliminating the need for separate substrate preparation and sidewall attachment steps. This merging of formation processes simplifies manufacturing and reduces assembly complexity.
Solution Approach 2:
The mold is designed with raised portions that pre-form the sidewall structures during the initial substrate formation. This preliminary action of creating sidewalls during substrate molding eliminates subsequent assembly steps, as the sidewalls are already in place before sample insertion. The adhesive is also pre-applied to specific regions during molding, preparing the structure for final assembly without additional processing steps.
2Productivity
If multiple separate components are assembled to create sample storage devices, then the devices can be manufactured, but production efficiency decreases
Solution Approach 1:
The patent merges multiple formation operations into a single molding process. The substrate, sidewalls, and adhesive placement are all accomplished in one continuous operation using a specially designed mold, rather than requiring separate steps for each component. This significantly reduces production time and increases manufacturing efficiency.
Solution Approach 2:
The mold is segmented into different functional regions (first mold portion for substrate, second mold portion for sidewalls with raised portions) that work simultaneously during a single molding cycle. This segmentation allows different parts of the device to be formed in parallel, maintaining high productivity while enabling complex structures.
3Ease of operation
If adhesives are used to join substrates and sidewalls, then the components can be assembled, but adhesive leakage occurs
Solution Approach 1:
The mold includes raised portions that create localized adhesive application zones. The adhesive is applied only to specific regions where sidewalls need to be attached to the substrate, rather than across the entire surface. This localized adhesive placement prevents leakage while ensuring proper bonding at critical junctions.
Solution Approach 2:
The raised portions of the mold act as intermediaries that control adhesive distribution. These raised structures guide the adhesive to precise locations and limit its spread, preventing leakage while facilitating proper adhesion. The mold geometry itself mediates the adhesive flow and placement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and enables the production of sample storage devices with precise sidewall control and rapid assembly, facilitating large-scale production while preventing adhesive leakage.
Implementation Method 1
radiating UV with the liquid UV curable resin accommodated in the engraved pattern part and thereby curing the liquid UV curable resin
Data Source
AI summary
According to the method for manufacturing a sample storage device and to the sample storage device of the present invention, a pattern forming mold having an engraved pattern part on the upper surface thereof is used to form a charging chamber sidewall on a first light-transmitting substrate, and a second light-transmitting substrate is adhered to the first light-transmitting substrate where the charging chamber sidewall is formed, and thus the sample storage device can be conveniently manufactured in large quantities.