Sandwich Connector IC Packaging for High Density Interconnects
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Solution Overview
Problem
Conventional wire bonding techniques for integrated circuit packaging face challenges with increased electrode density, leading to wire rupture and assembly yield loss due to the need for smaller wire diameters, which complicates the manufacturing of smaller and thinner IC packages for portable devices.
Innovation Solution
The implementation of a sandwich connector system with a top attachment wider than the bottom attachment, coupled with a sandwich bonding process that includes ultra-low loops and additional bump bonds, provides improved reliability and assembly yield by reducing wire diameter requirements and enhancing ball neck strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If wire diameter is reduced to accommodate increased electrode density, then electrode area occupation is reduced, but wire rupture resistance deteriorates
Solution Approach 1:
The patent applies parameter changes by transitioning from conventional wire bonding to a bump bonding process using a bump forming apparatus. This changes the bonding mechanism from wire-based to bump-based, allowing for smaller pitch accommodations while maintaining structural integrity and reliability without the wire rupture issues that plague thin wire bonding
Solution Approach 2:
The invention replaces the mechanical wire bonding system with a bump formation system. Instead of using wires that are prone to rupture, the patent forms bumps directly on the electrodes through a specialized bonding process, substituting the mechanical wire structure with a more reliable bump structure that better withstands the stresses of assembly
2Device complexity
If conventional wire bonding is used for high electrode density, then manufacturing process is simple, but assembly yield deteriorates due to wire rupture
Solution Approach 1:
The patent replaces the conventional wire bonding mechanical system with a bump bonding system using specialized apparatus. This substitution eliminates wire rupture issues and improves assembly yield, despite the increased complexity of the bonding apparatus required
3Volume of moving object
If wire diameter is made small for compact IC packaging, then package size is reduced, but manufacturing reliability deteriorates
Solution Approach 1:
The invention substitutes wire-based bonding with bump-based bonding to achieve compact packaging without compromising reliability. The bump formation process allows for smaller pitch and reduced package size while maintaining bonding strength and avoiding the wire rupture problems that occur with thin wires
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved package reliability, assembly yield, and manufacturing cost savings by reducing wire diameter dependence and enhancing ball pull and shear test results, while maintaining robust bonding quality.
Implementation Method 1
both components are pressure-bonded through ultrasonic waves
Implementation Method 2
The tip of the wire is heated to melt by arc heat input, the surface tension is used to form a ball
Implementation Method 3
the surface tension is used to form a ball
Implementation Method 4
a hot pressure bonding is affected after each tip thereof has been balled up by arc
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a carrier top side; mounting an integrated circuit over the carrier top side; attaching a bottom attachment directly on the integrated circuit; dragging a sandwich connector from the bottom attachment, the sandwich connector having a connector diameter; and attaching a top attachment directly on the sandwich connector, the top attachment wider than the bottom attachment.