Sandwich Power Module Layout With Embedded Capacitors for Heat Dissipation
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Solution Overview
Problem
High-power density and high-efficiency power converters with excellent heat dissipation are needed for modern GPUs and CPUs, which require higher current and smaller size, but existing power modules face challenges in heat conduction and circuit density due to the large size of output capacitors.
Innovation Solution
A sandwich structure power supply module is designed with inductors, power switches, drivers, and output capacitors integrated in a compact form, featuring an inductor pack, PCBs, power device chips, and embedded capacitors to reduce size and improve heat dissipation, while maintaining high power delivery efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional power module layout is used with discrete output capacitors, then capacitance value can be achieved, but module size becomes large and heat dissipation is poor
Solution Approach 1:
The output capacitors are embedded within the inductor pack structure, nesting one component inside another. The inductor pack serves as a container housing the capacitors, thereby reducing overall module volume while achieving the required capacitance value.
Solution Approach 2:
The patent transitions from a planar layout to a three-dimensional stacked architecture. Components are arranged in multiple layers vertically, with the inductor pack and embedded capacitors forming a compact vertical structure that reduces footprint area while maintaining electrical performance.
2Power
If higher current is used to achieve better processor performance, then processing power is improved, but heat conduction becomes more difficult
Solution Approach 1:
A heat spreader is introduced as an intermediary component between the power devices and the external environment. This heat spreader distributes and conducts heat away from the high-current power devices, enabling effective thermal management for high-power applications.
Solution Approach 2:
The heat spreader is integrated within the module structure, nesting the thermal management function inside the power module itself. This allows heat conduction pathways to be built into the module architecture rather than requiring external cooling solutions.
3Volume of moving object
If smaller size is used to reduce module footprint, then space efficiency is improved, but circuit density and heat dissipation become more challenging
Solution Approach 1:
The patent employs a multi-layer PCB structure with components distributed across different vertical levels. This three-dimensional arrangement increases effective circuit area without increasing footprint, allowing complex circuits to be packed into a smaller volume while maintaining manufacturability.
Solution Approach 2:
Multiple functions are combined into integrated components and structures. The inductor pack simultaneously provides magnetic coupling and houses output capacitors, while the heat spreader integrates thermal management with structural support, reducing overall component count and simplifying the compact design.
4Quantity of substance
If output capacitors are made larger to achieve required capacitance, then capacitance value is improved, but conduction losses increase
Solution Approach 1:
The output capacitors are embedded within the inductor pack, creating a nested configuration where the capacitor leads are shorted and positioned close to the switching nodes. This minimizes loop area and reduces parasitic inductance, thereby lowering conduction losses while achieving the required capacitance.
Data Source
AI summary
A power supply module comprises an inductor pack, a top PCB (Printed Circuit Board) on top of the inductor pack, a bottom PCB disposed below the inductor pack, a connector connected between the bottom PCB and the top PCB, two power device chips on top of the top PCB, an output capacitor substrate layer disposed below the bottom PCB, and an interposer substrate layer disposed below the output capacitor substrate layer. The inductor pack comprises two inductors, each inductor having a first end and a second end. The two power device chips are respectively connected to the first ends of the two inductors via the top PCB. A first output capacitor and a second output capacitor are embedded within the output capacitor substrate layer, and are respectively connected to the second ends of the two inductors to provide a first output voltage and a second output voltage.