Sandwich Power Module Layout for Compact PCB Cooling
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Solution Overview
Problem
The challenge of integrating high-power density and efficient heat dissipation in power converters for modern GPUs and CPUs is exacerbated by the need for smaller form factors, which complicates heat conduction and requires innovative designs to manage higher currents and smaller sizes.
Innovation Solution
A sandwich structure power supply module is introduced, featuring inductors and power switches integrated within a compact design, utilizing a magnetic core with passageways and windings, and metal layers connected to different potentials to minimize trace impedance and enhance cooling, while maximizing inductance and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the power converter size is reduced to meet smaller form factor requirements, then the form factor is improved, but heat dissipation becomes more difficult and heat conduction is compromised
Solution Approach 1:
The patent transitions from a planar PCB layout to a three-dimensional stacked architecture where power devices, inductors, and heat sinks are vertically arranged. This vertical stacking enables heat dissipation in the Z-dimension through direct-attached heat sinks, effectively resolving the heat management issue in compact form factors by utilizing the third dimension for thermal pathways.
Solution Approach 2:
The patent implements nested positioning where inductors are placed within or adjacent to power device packages, and heat sinks are directly attached to power devices. This nested arrangement maximizes space utilization and creates direct thermal coupling, allowing heat to be conducted from the power device through the inductor structure to the heat sink, thereby maintaining effective heat dissipation in a reduced volume.
2Productivity
If higher load current is used to achieve better processor performance, then the processing performance is improved, but heat conduction challenges increase
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional PCB thermal management system and integrates it directly into the power device package structure. By incorporating dedicated heat sink structures directly attached to power devices, the design creates an independent thermal management pathway that efficiently handles the increased heat load from higher current operation, separating thermal management from the electrical circuit board.
Solution Approach 2:
The patent employs composite structures combining different materials with complementary properties - power devices are paired with heat sink materials having high thermal conductivity, and inductors are positioned to utilize both magnetic and thermal properties. This composite approach optimizes both electrical performance for high current handling and thermal conduction for efficient heat removal.
3Area of stationary object
If inductors and power devices are integrated in a compact sandwich structure, then the PCB footprint is reduced, but the complexity of integrating multiple components increases
Solution Approach 1:
The patent merges multiple previously separate components into an integrated sandwich structure where power devices, inductors, and heat sinks are combined into a single modular assembly. This integration eliminates the need for separate PCB mounting of each component, reducing PCB footprint while the modular nature of the sandwich structure manages integration complexity by pre-assembling components into standardized units.
Solution Approach 2:
The patent segments the power converter system into distinct modular layers (power device layer, inductor layer, heat sink layer) that can be independently designed and manufactured, then assembled together. This segmentation allows each component to be optimized separately while the standardized interface between layers manages the overall integration, reducing the complexity burden on the PCB assembly process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves higher power density, reduced PCB footprint, improved current delivery efficiency, and effective heat dissipation, benefiting systems like GPUs and CPUs with enhanced performance and cooling capabilities.
Implementation Method 1
minimize the output current trace impedance on PCB and mainly deliver output current through inductor legs
Implementation Method 2
an inductor pack having at least one inductor; a magnetic core having two passageways passing through the magnetic core
Data Source
AI summary
A sandwich structure power supply module, having: an inductor pack having at least one inductor; a top PCB (Printed Circuit Board) on top of the inductor pack; and at least one power device chip on top of the top PCB, wherein each one of the power device chips has at least one pin connected to an associated inductor via the top PCB; wherein the inductor pack is wrapped with metal layers, wherein each two metal layers are lied against to a same surface of the inductor pack, with an isolation layer in between, and wherein the two metal layers are connected to different potentials.