Sandwich Power Module Layout for Compact GPU and CPU VRMs
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Solution Overview
Problem
The challenge of integrating high-power density and high-efficiency power converters with effective heat dissipation in small form factors is exacerbated by the increasing current demands of modern GPUs and CPUs, which require improved heat conduction and reduced size.
Innovation Solution
A sandwich structure power supply module is designed with inductors and power switches integrated on a PCB, featuring a magnetic core with passageways for windings and metal layers connected to different potentials, minimizing trace impedance and enabling top-side cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If higher current is used to achieve better processor performance, then processing performance is improved, but heat dissipation becomes more difficult and size reduction is hindered
Solution Approach 1:
The patent transitions from planar PCB mounting to three-dimensional stacked architecture, placing inductors vertically above PCB traces. This vertical dimensionality change shortens current paths, reduces PCB footprint, and improves heat dissipation efficiency by concentrating power components in a compact vertical space rather than spreading them across a large horizontal area
Solution Approach 2:
The patent implements nested arrangement where inductors are positioned within the vertical space above the PCB, and metal layers are embedded within the inductor structure. This nesting approach allows multiple functional elements to occupy overlapping spatial regions, maximizing space utilization and enabling high current density in a compact form factor
2Volume of moving object
If smaller size is used for microprocessor, then integration density is improved, but heat conduction becomes more challenging
Solution Approach 1:
By stacking inductors vertically above the PCB rather than laying them flat, the patent compresses the power conversion system into a smaller horizontal footprint. This vertical stacking maintains efficient heat conduction paths while reducing the overall device area, allowing better integration density without sacrificing thermal performance
Solution Approach 2:
The patent merges the inductor magnetic core with the PCB structure by embedding metal layers within the inductor and directly coupling them to PCB power traces. This merging eliminates separate heat dissipation paths and creates integrated thermal conduction channels that efficiently conduct heat away from the compact structure
3Ease of manufacture
If inductors are mounted on PCB, then assembly is simplified, but PCB footprint increases and current density decreases
Solution Approach 1:
The patent reduces PCB footprint by moving inductors from the PCB plane to the vertical dimension above it. This allows standard PCB assembly techniques to be used while achieving three-dimensional space utilization, thereby decreasing the horizontal area occupied without complicating the manufacturing process
Solution Approach 2:
The patent segments the inductor structure into discrete components (magnetic core, windings, metal layers) that can be independently manufactured and then assembled onto the PCB. This segmentation maintains manufacturing simplicity while enabling compact vertical integration that reduces overall footprint
4Loss of energy
If metal layers are added around inductor, then current path impedance is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent merges the metal layers with the inductor structure by embedding them within the magnetic core or positioning them in direct contact with the inductor windings. This integration reduces the number of separate assembly steps and eliminates the need for additional PCB trace routing, thereby reducing impedance without significantly increasing manufacturing complexity
Solution Approach 2:
The metal layers are nested within or around the inductor structure, creating concentric current paths that minimize loop area and impedance. This nested arrangement allows multiple metal layers to be incorporated without proportionally increasing assembly complexity, as they are positioned during the same inductor mounting process
Data Source
AI summary
A power supply module having at least one inductor modules, a top PCB mounted on top of the at least one inductor modules, and at least one pair of power device chips mounted on top of the top PCB, wherein power pins and signal pins for connecting the top PCB and a board that the at least one inductor modules are attached to, are implemented by metal layers wrapping each of the at least one inductor modules.