Sapphire Cover Window Wafer-Level Manufacturing

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Solution Overview

Problem

The existing manufacturing process for sapphire cover windows is inefficient due to the need for multiple incompatible jigs and high defect rates, especially for small sizes, leading to low yield and increased production costs.

Innovation Solution

A method that performs the entire process at the wafer level using a sapphire wafer, where a cell edge processing portion is formed with a laser and an etched portion is created through wet etching, allowing cells to be separated without jigs, optimizing laser processing and wet etching conditions to maintain the wafer form and improve durability and scratch resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the existing cell process is used to manufacture sapphire cover windows, then the process can be performed with current equipment, but multiple incompatible jigs are required and handling is frequently needed, resulting in extremely low efficiency and high defect rates

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidnumber of jigs
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent merges multiple separate jig-based processes into a single wafer-level process. Instead of using multiple incompatible jigs for cleaning, printing, AR coating, and AF coating at the unit cell level, the invention performs all these processes simultaneously at the wafer level using a single wafer holder, eliminating the need for frequent handling and multiple specialized jigs.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from processing at the unit cell level (2D individual cells) to processing at the wafer level (larger dimensional substrate). By maintaining cells in a wafer form during all manufacturing processes and only separating them after completion, the invention eliminates the need for repeated handling and jig changes, dramatically improving productivity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of operation

If unit cells are completely cut and processed individually, then each cell can be processed independently, but handling frequency increases and defect rates increase, especially for small cells

Engineering Contradiction:
Improvecell processing independenceVSAvoidprocess defect rate
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The patent performs preliminary cutting of the sapphire wafer into cell regions before the manufacturing processes. However, instead of completely separating the cells, the invention maintains the wafer form with cells connected to each other or to a dummy during all subsequent processes. The complete separation is performed only after all manufacturing processes are completed, preventing defects that would result from frequent handling of individual small cells.

Inventive Principle:
Principle #10Preliminary action

3Ease of manufacture

If small cells are processed using the existing jig system, then the process can be completed, but cell handling is not easy and loading/unloading must be repeated, resulting in low yield and increased production costs

Engineering Contradiction:
Improveprocess completionVSAvoidproduction yield
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The patent creates a universal wafer-level processing system that can handle all manufacturing steps (cleaning, printing, AR coating, AF coating) for cells of various sizes without requiring size-specific jigs. The wafer holder serves multiple functions and accommodates different cell configurations, eliminating the need for repeated loading and unloading operations and significantly improving production yield.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the manufacturing process, reduces defect rates, and enhances the durability and scratch resistance of sapphire cover windows, particularly for small products like camera cover windows, by eliminating the need for jigs and improving productivity.

Implementation Method 1

forming a cell edge processing portion on the sapphire wafer with a laser beam

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

forming an etched portion on the sapphire wafer by selectively performing wet etching on the cell edge processing portion

Methodology Applied
Scientific EffectWet etching:

Implementation Method 3

separating a cell from the sapphire wafer by compressing the sapphire wafer on which the etched portion is formed

Methodology Applied
Scientific EffectMechanical compression: Compression

Data Source

PatentUS20240067555A1Method of manufacturing sapphire cover window and sapphire cover window manufactured thereby
Publication Date: 2024.02.29 UTI INC
  • US20240067555A1 patent drawing
  • US20240067555A1 patent drawing
  • US20240067555A1 patent drawing

AI summary

Proposed are a method of manufacturing a sapphire cover window, which includes: preparing a sapphire wafer; forming a cell edge processing portion on the sapphire wafer with a laser beam; forming an etched portion on the sapphire wafer by selectively performing wet etching on the cell edge processing portion; and separating a cell from the sapphire wafer by compressing the sapphire wafer on which the etched portion are formed, and a sapphire cover window manufactured thereby.