Sapphire Interposer Load Hole for Ion Trap Optical Access
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Solution Overview
Problem
Existing ion trap designs face challenges in reducing size, managing heat load, and ensuring efficient optical access, particularly in high numerical aperture optical beam applications, while existing interposer solutions complicate assembly and alignment.
Innovation Solution
An interposer made from an electrically insulating and thermally efficient substrate like sapphire, with a load hole aligned with the ion trap, provides efficient heat sinking, electrical routing, and allows backside loading, simplifying assembly and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a traditional interposer design is used for ion trap, then electrical routing is provided, but assembly and alignment become complicated
Solution Approach 1:
The patent combines the interposer and mounting plate into a single integrated component. The interposer is formed as a monolithic piece with an oblique load hole that directly receives the ion trap, eliminating the need for separate mounting plates and simplifying assembly. This merging of functions resolves the contradiction by reducing device complexity while improving ease of manufacture and alignment.
Solution Approach 2:
The interposer serves multiple functions simultaneously: it provides electrical routing through its substrate structure, acts as a mounting plate for the ion trap via the oblique load hole, and enables optical access through its angled design. This multi-functionality eliminates the need for separate specialized components, simplifying assembly while maintaining all necessary functions.
2Volume of moving object
If ion trap size is reduced, then integration density increases, but optical access and heat management become more difficult
Solution Approach 1:
The patent introduces an oblique (angled) load hole configuration instead of a traditional vertical hole. This angular dimension allows optical beams to access the ion trap from the side while the trap remains compact. The oblique path provides sufficient optical access for laser cooling and manipulation even when the ion trap volume is reduced, resolving the contradiction between size reduction and optical access.
3Volume of moving object
If ion trap size is reduced, then integration density increases, but heat load management becomes more difficult
Solution Approach 1:
The interposer is designed as a thermally conductive substrate that is directly coupled to the ion trap. By merging the thermal management function into the interposer structure itself, efficient heat sinking is achieved even in the compact configuration. The interposer acts as a heat sink, conducting away RF heating from the ion trap electrodes, thus managing heat load effectively despite the reduced size.
4Illumination intensity
If angled traces are used for wire bonding, then light access is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs oblique (angled) traces on the interposer substrate for wire bonding connections. These angled traces are configured to provide clear optical paths for laser beams while maintaining manufacturability. The angular geometry is designed to balance optical access requirements with standard manufacturing capabilities, avoiding excessively tight tolerances while still achieving the necessary light access for ion trap operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances optical access and reduces alignment complexities, improving the performance and operation of ion traps in quantum information processing systems by integrating heat sinking and electrical routing in a single monolithic piece.
Implementation Method 1
an electrically insulating and thermally efficient substrate (e.g., sapphire)
Data Source
AI summary
An interposer is described that is made from an electrically insulating, thermally efficient substrate (e.g., sapphire) and has a load hole for use with ion traps in atomic-based QIP architectures. The interposer load hole aligns with a load hole in the ion trap such that atomic species can be provided from the back of the interposer to the front of the ion trap for ionization and confinement. The interposer may include angled traces for wire bonding to the ion trap, where the angled traces enable more open light access when using laser or optical beams during operation of the ion trap. Electrical routing in the interposer may involve more than one layer of routing, separated by an insulating dielectric material such as a polyimide. Routing in the interposer may also contain active electronic components. The load hole in the interposer may have a straight or tapered inner wall.