SAQP Core Removal Sequencing to Prevent Spacer Feature Tipping
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Solution Overview
Problem
Conventional spacer-on-spacer self-aligned quadruple patterning techniques face issues with first spacer features tipping over during substrate transfer and cleaning, leading to defects and low yield due to the absence of structural support during these processes.
Innovation Solution
The proposed method involves removing cores in-situ to the second spacer deposition, maintaining structural support during substrate transfer and cleaning, thereby preventing first spacer features from tipping over and ensuring conformal deposition of the second spacer layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If cores are removed early to form first spacer features, then patterning can proceed, but first spacer features tip over during substrate transfer and cleaning
Solution Approach 1:
The patent applies preliminary action by performing core removal and first spacer feature formation before substrate transfer and cleaning operations. However, to prevent tipping, the method strategically delays complete core removal until after these critical operations, using the cores as temporary structural supports during transfer and cleaning, then removing them in a controlled manner afterward to form the first spacer features.
Solution Approach 2:
The patent implements beforehand cushioning by retaining the cores as structural supports during substrate transfer and cleaning operations. The cores act as a cushioning support structure that prevents the thin first spacer features from tipping over under mechanical stress during handling, before the cores are eventually removed to form the desired spacer features.
2Ease of manufacture
If substrate is transferred and cleaned after core removal, then processing can continue, but first spacer features are compromised due to lack of structural support
Solution Approach 1:
The patent performs substrate transfer and cleaning operations before core removal. This preliminary sequencing ensures that the substrate and its features are handled and cleaned while the cores provide structural support, preventing damage during these critical processing steps, and then cores are removed afterward to form the spacer features.
Solution Approach 2:
The cores serve as a protective cushioning structure during substrate transfer and cleaning operations. They provide mechanical support that prevents the fragile first spacer features from tipping or deforming under handling stresses, ensuring manufacturing precision is maintained before the cores are removed.
3Reliability
If cores are removed in-situ to second spacer deposition, then structural support is maintained, but process complexity increases
Solution Approach 1:
The patent merges multiple process steps into a single integrated workflow. Core removal, first spacer feature formation, substrate cleaning, and second spacer deposition are combined into a sequential process that occurs without removing the substrate from the reaction chamber. This consolidation maintains structural support while reducing the number of separate operations and chamber transfers required.
Solution Approach 2:
The reaction chamber is designed to perform multiple functions sequentially: it serves as the processing chamber for spacer deposition, the cleaning chamber for substrate cleaning, and the core removal chamber. This multi-functionality eliminates the need for separate chambers for each operation, reducing overall process complexity while maintaining the ability to remove cores in-situ for structural support.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces manufacturing defects and increases yield by maintaining the integrity of spacer features, resulting in fewer compromised substrates and reduced waste, thus enhancing manufacturing efficiency and reducing costs.
Implementation Method 1
removing the cores may include exposing the substrate to an oxygen-containing plasma to ash away the cores
Implementation Method 2
first spacer material lining the sidewalls of the cores
Implementation Method 3
etching back the first spacer layer to remove the first spacer material from horizontal surfaces while leaving the first spacer material on the sidewalls of the cores
Implementation Method 4
depositing a second spacer layer over the first spacer features
Data Source
AI summary
Methods, apparatus, and systems are provided herein for processing a substrate. Generally, the processing involves Spacer-on-Spacer (SoS) Self-Aligned Quadruple Patterning (SAQP) techniques. The disclosed techniques provide a novel process flow that reduces defects by ensuring that cores are not removed from the substrate until the substrate is transferred to a deposition chamber used to deposit a second spacer layer. This reduces or eliminates the risk of structural damage to features on the substrate while the substrate is being transferred or cleaned. Such structural damage is common when the cores are removed from the substrate prior to cleaning and transfer.