SAQP Core Removal Sequence for Spacer Stability
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Solution Overview
Problem
Conventional spacer-on-spacer self-aligned quadruple patterning techniques face issues with first spacer features tipping over during transfer and cleaning operations, leading to defects and low yield due to the absence of structural support during these steps.
Innovation Solution
The proposed method involves maintaining the cores on the substrate throughout transfer and cleaning operations, allowing them to provide mechanical support to the first spacer features, and removing the cores in the same chamber as the second spacer deposition to ensure the features remain vertical and avoid defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cores are removed before second spacer deposition, then manufacturing defects increase and yield decrease, but process complexity reduces
Solution Approach 1:
The patent combines core removal and second spacer deposition into a single continuous process step within the same reaction chamber. The core removal is performed using oxygen plasma to convert carbon cores to CO2, immediately followed by second spacer material deposition without substrate removal or chamber evacuation. This merging eliminates the structural support issue and prevents first spacer features from tipping over, thereby improving manufacturing yield while maintaining process integration.
Solution Approach 2:
The patent performs core removal as a preliminary action before second spacer deposition, but within the same process sequence. By removing cores first and then immediately depositing the second spacer material without interrupting the process flow, the method ensures that first spacer features have no chance to tip over during substrate handling. This preliminary action approach resolves the contradiction by maintaining process continuity while eliminating defects.
2Ease of manufacture
If substrate is removed from reaction chamber between core removal and second spacer deposition, then process simplicity increases, but first spacer features tip over causing defects
Solution Approach 1:
The patent merges core removal and second spacer deposition into a single uninterrupted process sequence within the same reaction chamber. The substrate remains on the substrate support throughout both operations, eliminating mechanical handling that would cause first spacer features to tip over. This merging maintains feature vertical alignment while achieving process simplicity through integration rather than through separate steps.
3Reliability
If cores provide structural support during transfer and cleaning, then manufacturing defects reduce, but process time increases
Solution Approach 1:
The patent eliminates the need for separate transfer and cleaning operations by performing core removal and second spacer deposition in a single continuous process within the same reaction chamber. The cores provide structural support throughout this integrated process sequence, preventing first spacer features from tipping over. By merging operations rather than extending the process timeline, the method improves manufacturing yield without proportionally increasing process time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces manufacturing defects and increases yield by ensuring conformal deposition of the second spacer layer without voids, thereby improving the efficiency and reducing waste.
Implementation Method 1
removing the cores may include exposing the substrate to an oxygen-containing plasma to ash away the cores
Implementation Method 2
exposing the substrate to an oxygen-containing plasma to ash away the cores
Implementation Method 3
depositing a second spacer layer over the first spacer features, where (b) and (c) occur in the same reaction chamber
Data Source
AI summary
Methods, apparatus, and systems are provided herein for processing a substrate. Generally, the processing involves Spacer-on-Spacer (SoS) Self-Aligned Quadruple Patterning (SAQP) techniques. The disclosed techniques provide a novel process flow that reduces defects by ensuring that cores are not removed from the substrate until the substrate is transferred to a deposition chamber used to deposit a second spacer layer. This reduces or eliminates the risk of structural damage to features on the substrate while the substrate is being transferred or cleaned. Such structural damage is common when the cores are removed from the substrate prior to cleaning and transfer.