Thermoelectric Heat Pump SAS Structure for Compression Protection
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Solution Overview
Problem
Thermoelectric modules (TEMs) in heat pumps are vulnerable to mechanical stresses and environmental contaminants, leading to reduced performance and efficiency due to thermal shorts caused by potting materials.
Innovation Solution
A thermoelectric heat pump with a surround and spacer (SAS) structure that protects TEMs from compression forces and environmental contaminants by using a wall with defined open sides for heat spreaders, preformed insulation, and mechanical or chemical fasteners to minimize thermal shorts and enhance structural strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If potting material is applied to protect TEMs from environmental contaminants, then reliability is improved, but thermal parasitics increase causing efficiency to worsen
Solution Approach 1:
The patent removes the harmful potting material entirely from the TEM assembly and replaces it with a mechanical support structure consisting of a printed circuit board with ribs that provide both structural support and environmental protection without thermal interference. This extracts the protective function while eliminating the thermal parasitic effect.
Solution Approach 2:
The patent introduces a thermal interface material or air gap as an intermediary between the TEMs and the printed circuit board, allowing mechanical support and environmental sealing while maintaining thermal isolation. This intermediary layer prevents direct thermal contact between hot and cold sides of the TEMs.
2Reliability
If mechanical support structures are added to protect TEMs from compression forces, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent makes the printed circuit board perform multiple functions: it provides electrical interconnection, mechanical support through integrated ribs, and environmental sealing. By combining these functions into a single component, the overall device complexity is reduced while maintaining protection for the TEMs.
Solution Approach 2:
The patent merges the mechanical support structure with the electrical interconnect board, creating an integrated assembly where the board itself provides structural reinforcement through molded-in ribs rather than requiring separate support components. This consolidation simplifies the overall device architecture.
3Strength
If heat spreaders are mechanically contacted to the SAS structure, then structural strength is improved, but thermal shorts may occur
Solution Approach 1:
The patent applies different properties to different parts of the heat spreader assembly: the central area maintains direct thermal contact with TEMs for heat transfer, while the peripheral edges are isolated from the SAS structure to prevent thermal shorts. This local differentiation allows simultaneous achievement of structural strength and thermal isolation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The SAS structure effectively absorbs compression forces, reduces thermal parasitics, and maintains high efficiency by minimizing heat transfer between hot and cold sides, thus protecting TEMs and improving the overall performance of the heat pump.
Implementation Method 1
Thermoelectric modules (TEMs) are often fabricated from fragile materials
Implementation Method 2
a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module
Implementation Method 3
A compression force applied to the heat pump is absorbed by the SAS structure
Data Source
Figure 1
Figure 2A~2B
Figure 2C
AI summary
A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings. The heat pump additionally includes a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module. The periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that any compression force applied to the heat pump is absorbed by the SAS structure.