Satellite Plate Adhesive Bonding via Suction
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Solution Overview
Problem
The assembly of space devices on satellite walls is time-consuming and restrictive, with existing methods requiring significant material thickness and being unsuitable for large plates, limiting modularity and increasing satellite mass, and existing adhesive techniques are not effective for large plates on satellite walls due to accessibility issues and inadequate calibration of adhesive joints.
Innovation Solution
A method involving attaching devices to a thin support plate with a fluid connector, using a continuous peripheral bead and discontinuous inner beads of polymerizable adhesive composition, and applying suction to create a negative pressure for bonding to a satellite support structure, allowing for efficient assembly of large plates with uniform adhesive joints and heat transfer capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thick plates (at least 4 mm) are used to attach devices to satellite walls by screwing, then the assembly is robust and reliable, but the satellite mass increases significantly
Solution Approach 1:
The patent replaces the traditional mechanical screwing system with a chemical bonding system using polymerizable adhesive compositions. The adhesive is applied as beads between the thin plate and support structure, then polymerized to create a strong chemical bond, eliminating the need for thick mechanical fasteners and reducing satellite mass while maintaining assembly robustness
Solution Approach 2:
The patent changes the bonding mechanism from mechanical (screws requiring thick plates) to chemical (adhesive polymerization). By controlling parameters such as adhesive composition, bead size, and polymerization conditions, the patent achieves reliable bonding with thin plates (less than or equal to 3 mm) that would be insufficient for mechanical fastening
2Weight of moving object
If adhesive bonding techniques are used to attach thin plates to satellite walls, then satellite mass is reduced, but accessibility to parts is restricted and device arrangement flexibility is limited
Solution Approach 1:
The patent applies adhesive beads to the plate before attachment, allowing the adhesive to be positioned and prepared in advance. The plate with pre-applied adhesive beads can then be brought into contact with the support structure, ensuring proper adhesive placement without requiring complex accessibility during the bonding process
Solution Approach 2:
The patent uses adhesive beads as an intermediary substance between the thin plate and support structure. These beads facilitate bonding while allowing for some adjustment and positioning during assembly, maintaining ease of operation despite using thin plates that cannot be mechanically adjusted
3Productivity
If existing adhesive techniques are used for bonding large plates, then assembly can proceed, but adhesive joint calibration is inadequate and assembly time is excessive
Solution Approach 1:
The patent applies adhesive in discrete beads at specific locations rather than uniformly across the entire plate surface. This localized application allows for precise control of adhesive joint thickness and positioning, achieving proper calibration while reducing overall adhesive material and assembly time
Solution Approach 2:
The patent uses a continuous peripheral bead and discontinuous inner beads, applying adhesive only where needed for structural bonding rather than covering the entire surface. This partial action approach achieves adequate calibration and bonding strength while significantly reducing assembly time and material usage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces assembly time and costs, enables modular device arrangement, and achieves strong, thermally conductive bonding with minimal material usage, suitable for large plates and heavy devices, while maintaining the structural and thermal requirements of satellite assembly.
Implementation Method 1
performing suction, via the fluid connector, so as to create a negative pressure between the plate and the support structure, in the volume delimited by the peripheral bead; at least partially polymerising each of the polymerisable adhesive compositions so as to form adhesive joints between the second face of the plate and the support structure
Implementation Method 2
performing suction, via the fluid connector, so as to create a negative pressure between the plate and the support structure, in the volume delimited by the peripheral bead
Implementation Method 3
The invention further intends for the means of assembly to procure heat transfers between the devices and the wall of the satellite
Data Source
AI summary
A method for assembling devices on a satellite structure is disclosed including attaching the devices to a first face of a plate drilled with a through-hole provided with a fluid connector, on a second face of the plate, depositing a continuous peripheral bead of polymerisable adhesive composition and depositing a plurality of discontinuous and disjointed inner beads of polymerisable adhesive composition, pressing the second face of the plate against a continuous face of the structure, performing suction so as to create a pressure differential between the plate and the structure, at least partially polymerising the polymerisable adhesive compositions so as to form adhesive joints between the plate and the structure, and interrupting the suction.