Satellite Power Amplifier Thermal Management

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Solution Overview

Problem

Aerospace systems, such as satellites, face significant thermal management challenges due to large temperature variations between sun-exposed and shaded areas, requiring effective heat removal solutions to maintain operational efficiency.

Innovation Solution

A system comprising a solid state power amplifier with a heat acquisition and transfer device, such as a microchannel cooling circuit, and a heat rejection device that radiates heat directly into space, utilizing Gallium-Nitride (GaN) materials to operate at high temperatures and position heat rejection on solar-exposed sides for efficient thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If heat rejection devices are positioned on sun-exposed sides of satellites, then thermal management efficiency is improved, but temperature variations between sun-exposed and shaded areas worsen

Engineering Contradiction:
Improvethermal management efficiencyVSAvoidtemperature variation
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The patent applies local quality by positioning heat rejection devices specifically on sun-exposed sides of the satellite where thermal radiation to space is most effective. This creates localized thermal management zones that optimize heat dissipation in critical areas while accepting temperature variations in other regions. The heat rejection devices are strategically placed to exploit the thermal environment of sun-exposed surfaces for efficient heat rejection.

Inventive Principle:
Principle #3Local quality

2Productivity

If heat acquisition and transfer devices are positioned proximate to heat generating elements, then heat removal efficiency is improved, but device complexity increases

Engineering Contradiction:
Improveheat removal efficiencyVSAvoidsystem complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent merges the heat acquisition and transfer functions into a single integrated device positioned proximate to heat generating elements. This combined device directly couples heat extraction from power amplifiers with thermal transport to rejection devices, eliminating the need for separate heat sinks, thermal interfaces, and transfer mechanisms. The merging reduces component count and system complexity while maintaining high heat removal efficiency through direct thermal coupling.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient heat rejection from satellites, optimizing spacecraft design by reducing material requirements for cooling fluid transport and allowing high-power devices to be placed in areas with higher solar exposure, thereby addressing thermal management issues in aerospace environments.

Implementation Method 1

a heat acquisition and transfer device positioned proximate at least one heat generating element on the solid state power amplifier, and a heat rejection device in thermal communication with the heat acquisition and transfer device

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

rejecting the heat directly into space

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS9590573B2System and method to remove heat from a power amplifier
Publication Date: 2017.03.07 THE BOEING CO
  • US9590573B2 patent drawing
  • US9590573B2 patent drawing
  • US9590573B2 patent drawing

AI summary

In one aspect a satellite comprises a body, a solid state power amplifier, a heat acquisition and transfer device positioned proximate at least one heat generating element on the solid state power amplifier, and a heat rejection device in thermal communication with the heat acquisition and transfer device to reject heat acquired from the solid state power amplifier. Other aspects may be described.