Satellite Bus Housing With Integral Panels for Heat Conduction
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Solution Overview
Problem
Existing satellite designs require heat pipes to conduct heat between panels, increasing fabrication time, complexity, and cost due to the need for bonding and additional components.
Innovation Solution
Integrally forming panels at non-straight angles with fillets at their interfaces to enhance heat conduction, eliminating the need for heat pipes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat pipes are used to conduct heat between panels, then heat transfer efficiency is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent removes the heat pipes from the system entirely and replaces them with an integral structural design where panels are directly connected through fillets, eliminating the need for separate heat conduction components while maintaining thermal transfer capability
Solution Approach 2:
The patent merges the structural support function and heat conduction function into a single integrated panel structure, where the fillet serving as a structural connector also serves as the heat conduction path, eliminating the need for separate heat pipes
2Temperature
If heat pipes are bonded between panels, then heat conduction is achieved, but manufacturing time and cost increase
Solution Approach 1:
The panel structure and heat conduction path are merged into a single integral component manufactured as one piece, eliminating the need for separate bonding steps and reducing fabrication time
Solution Approach 2:
The heat conduction capability is built into the panel structure during the initial manufacturing process rather than being added later through bonding, allowing heat transfer functionality to be established beforehand
3Temperature
If panels are formed at non-straight angles with fillets, then heat conduction area is increased, but structural complexity increases
Solution Approach 1:
The patent uses fillet curves at the panel interfaces to create smooth transitions and increase the heat conduction contact area, replacing sharp angles with curved surfaces that enhance thermal contact
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates efficient heat transfer without heat pipes, reducing fabrication time, cost, and complexity, enabling standardized mass production of satellites.
Implementation Method 1
the integral formation of the first and second panels facilitating heat conduction between the first and second panels
Implementation Method 2
a fillet formed at an interface where the first and second panels come together, the fillet increasing a thickness at the interface to increase the area available to conduct heat between the first and second panels
Data Source
AI summary
An orbital satellite has a bus formed of a bus module and a payload module. Both the bus module and the payload modules may include a pair of panels integrally formed at an angle of for example 90° with respect to each other. Components and electronics supporting the satellite systems may be mounted on the panels of the bus and payload modules. Heat generated by the components and electronics are conducted between panels of the bus module and/or payload module. Sufficient heat transfer between panels occurs as a result of their being integrally formed with each other.