Satellite Aluminum Panel Structure With Integrated Heat Pipes

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Solution Overview

Problem

Conventional satellite construction using aluminum honeycomb panels is costly and difficult to manufacture, requiring specialized interface structures for payload elements, and lacks efficient thermal management solutions.

Innovation Solution

Utilizing stamped aluminum panels with integrated grooves for heat transport elements, such as copper-water heat pipes or carbon nanotube materials, to form an enclosed structure that transports heat away from onboard equipment without casings, enhancing thermal conductivity and reducing manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If aluminum honeycomb panels are used to construct load-bearing structures, then the structure achieves high stiffness-to-density ratio and lightweight properties, but manufacturing becomes expensive and difficult, and specialized interface structures are required to fix payload elements

Engineering Contradiction:

Improvestructure weightVSAvoidmanufacturing complexity

Core Design Contradiction:

Weight of moving objectVSEase of manufacture

Solution Approach 1:

The patent replaces expensive, difficult-to-manufacture aluminum honeycomb panels with conventional, easily fabricated aluminum panels that can be readily manufactured and modified. The focus shifts from using expensive lightweight materials to using conventional materials in a configuration that achieves both lightweight properties and ease of manufacture through integrated groove features

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The aluminum panels are designed with integrated grooves that serve multiple functions: providing structural support, enabling thermal management through heat transport element placement, and offering standardized interfaces for mounting payload elements. This multi-functionality eliminates the need for separate specialized interface structures

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Weight of moving object

If aluminum honeycomb panels are used, then lightweight structure is achieved, but specialized interface structures are required to fix payload elements thereto

Engineering Contradiction:

Improvestructure weightVSAvoidinterface structure complexity

Core Design Contradiction:

Weight of moving objectVSDevice complexity

Solution Approach 1:

The patent merges the mounting interface functionality directly into the aluminum panel structure by incorporating grooves that serve as both structural features and mounting interfaces. Payload elements can be directly mounted to these grooves without requiring separate specialized interface structures, thereby reducing device complexity while maintaining lightweight properties

Inventive Principle:

Principle #5Merging (Combining)

3Temperature

If conventional thermal management solutions are used, then thermal management is provided, but additional interface structures and increased device complexity are required

Engineering Contradiction:

Improvethermal managementVSAvoidinterface structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent merges thermal management functionality into the panel structure itself by incorporating grooves that house heat transport elements. This integration eliminates the need for separate thermal management components and their associated interface structures, reducing device complexity while providing effective thermal management for onboard equipment

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a cost-effective and efficient thermal management system for satellites, allowing for pressurized interiors and improved heat dissipation without the need for additional interface structures, thus optimizing thermal performance and manufacturing efficiency.

Implementation Method 1

heat transport element positioned in the groove... configured to transport heat away from the plurality of onboard equipment elements

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the at least one heat transport element includes at least one of a copper-water heat pipe, a carbon nanotube based material, an aluminum-ammonia heat pipe or a carbon nanotube

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 3

the conductive filler is configured to transport heat from the plurality of onboard equipment elements to the at least one heat transport element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20260070677A1Space vehicle thermal management system and method for manufacture thereof

Publication Date: 2026.03.12 NETWORK ACCESS ASSOC LTD

AI summary

A space vehicle includes a first aluminum panel, a second aluminum panel fixed to the first aluminum panel around at least a portion of respective perimeters thereof to thereby form an enclosed structure having an interior volume, a plurality of grooves formed in at least one of the first aluminum panel or the second aluminum panel, at least one heat transport element positioned in at least one of the plurality of grooves, and a plurality of onboard equipment elements, where at least one of the plurality of onboard equipment elements is positioned adjacent to the heat transport element, where at least some of the plurality of onboard equipment elements lack a casing, and where the at least one heat transport element is configured to transport heat away from the plurality of onboard equipment elements.