Satellite Payload Built-In Test for Parallel Verification
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Solution Overview
Problem
Current satellite payload testing methods are inefficient, expensive, and time-consuming due to the need for extensive cabling and elaborate thermal maintenance systems, introducing measurement uncertainty and requiring serial testing of components, which limits production and deployment.
Innovation Solution
Integration of built-in testing components on the satellite to perform self-testing, allowing for simultaneous testing of multiple components and reducing the reliance on external test equipment by generating and receiving test signals within the satellite environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external testing equipment is used to test satellite payload components, then measurement accuracy can be maintained, but testing time and complexity increase significantly
Solution Approach 1:
The patent implements built-in self-test (BIST) circuits within the satellite payload components themselves. These BIST circuits generate test signals internally and perform self-diagnosis without requiring external testing equipment, enabling the system to test itself autonomously. This eliminates the time-consuming process of connecting external equipment while maintaining measurement accuracy through integrated testing pathways.
Solution Approach 2:
The patent extracts the testing function from external equipment and integrates it directly into the payload components. By embedding BIST circuits within the payload, the testing capability is removed from the external environment and incorporated into the component itself, eliminating the need for lengthy cabling and external test equipment setup.
2Reliability
If external testing equipment with lengthy cabling is used, then comprehensive testing can be performed, but device complexity and cost increase
Solution Approach 1:
The patent merges the testing function with the payload components by integrating BIST circuits directly into the satellite payload. This consolidation eliminates the need for separate external testing equipment, lengthy cabling, and elaborate thermal maintenance systems, thereby reducing overall system complexity while maintaining comprehensive testing capability through internal test signal pathways.
3Measurement precision
If serial testing of components is performed using limited test equipment, then measurement accuracy is maintained, but productivity decreases
Solution Approach 1:
Each payload component is equipped with its own BIST circuit that performs self-testing autonomously. This eliminates the need for serial testing with limited external equipment, as multiple components can simultaneously test themselves in parallel, dramatically increasing testing throughput while maintaining measurement accuracy through integrated testing pathways.
Solution Approach 2:
The BIST circuits are pre-integrated into the payload components during manufacturing, so that testing capability is already in place before satellite assembly. This preliminary integration of testing functionality allows for immediate parallel testing of multiple components without requiring sequential setup of external equipment.
4Measurement precision
If elaborate thermal maintenance systems are used for external testing, then testing accuracy in orbit conditions is improved, but testing time and cost increase
Solution Approach 1:
The patent removes the elaborate thermal maintenance systems from the external testing environment and integrates thermal management directly into the payload components. By incorporating on-board thermal control within the satellite payload, the system can maintain accurate orbit environment conditions during testing without requiring external thermal infrastructure, thereby reducing setup time and cost.
Data Source
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AI summary
According to an embodiment, a testing system for a satellite payload includes a built-in testing component configured at a satellite, the built-in testing component comprising a built-in testing component input and a built-in testing component output, and a payload component configured at the satellite, the payload component comprising a payload component input communicatively connected to the built-in testing component output and a payload component output communicatively connected to the built-in testing component input, wherein the built-in testing component is configured to transmit a digital test signal from the built-in testing component output to the payload component input and receive a digital output signal at the built-in testing component input from the payload component output.