SAW Filter Package Structure With Preformed Conductive Layers
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Solution Overview
Problem
Conventional surface acoustic wave filter package structures face challenges in simplifying manufacturing flow, controlling yield, and reducing costs due to complex electrical connection designs, which can lead to chip damage and pollution during the electroplating process.
Innovation Solution
A surface acoustic wave filter package structure utilizing panel level packaging with a dielectric substrate, polymer sealing frame, and mold sealing layer, featuring patterned conductive layers and a conductive connection layer, along with a manufacturing method that includes forming dielectric substrates, arranging polymer sealing frames, and applying a mold sealing layer to encapsulate the chip, thereby simplifying the process and improving efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electroplating process is used to form plated metal film on exterior of package structure, then electrical connection is achieved, but manufacturing complexity increases and chip damage risk increases
Solution Approach 1:
The patent applies preliminary action by pre-forming the conductive connection layer and patterned conductive layers on the dielectric substrate before chip mounting. This allows electrical connections to be established through the substrate rather than requiring post-assembly electroplating, thereby simplifying the manufacturing process while maintaining connection reliability.
Solution Approach 2:
The patent extracts the electroplating process from the manufacturing flow by replacing it with a pre-formed conductive connection layer approach. This eliminates the harmful electroplating step that causes chip damage and pollution, while still achieving the necessary electrical connections through the conductive layers integrated into the dielectric substrate.
2Reliability
If conventional electroplating process is used, then electrical connection is achieved, but chip pollution and damage occur
Solution Approach 1:
The patent converts the harmful electroplating process into a beneficial pre-formed conductive layer approach. By establishing electrical connections through the conductive connection layer and patterned conductive layers before chip mounting, the harmful electroplating step is eliminated, preventing chip pollution and damage while maintaining connection reliability.
Solution Approach 2:
The patent extracts and removes the harmful electroplating process from the manufacturing sequence. Instead of applying electroplating after assembly, the solution uses pre-formed conductive layers that establish connections without exposing chips to harmful chemicals, thereby eliminating pollution and damage risks.
3Productivity
If panel level packaging is used, then productivity increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies segmentation by dividing the large panel into multiple smaller packaging units, each with its own dielectric substrate and conductive layers. This allows batch processing while maintaining manageable alignment requirements for each segment, thereby improving productivity without excessive precision demands.
Solution Approach 2:
The patent uses preliminary action by pre-forming the conductive connection layers and patterned conductive layers on the dielectric substrates before chip mounting. This preparation work is done at the panel level, enabling subsequent batch processing with reduced alignment complexity, thus improving productivity while controlling precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables batch packaging of chips, significantly improving yield and reducing costs, while ensuring the structural integrity and reliability of the SAW filter package, allowing it to perform effectively in various environments with enhanced filtering efficiency.
Implementation Method 1
its operation principle is that electrical signal is changed to mechanical wave in a piezoelectric material, and the delayed mechanical wave is changed to electrical signal by an output electrode
Implementation Method 2
the plated metal film 16 is formed on the exterior of the package structure by electroplating process
Data Source
AI summary
A surface acoustic wave (SAW) filter package structure includes a dielectric substrate having a dielectric layer, a first patterned conductive layer, a second patterned conductive layer, and a conductive connection layer. The conductive connection layer is electrically connected between the first patterned conductive layer and the second patterned conductive layer, which are disposed at opposite sides of the dielectric layer. The second patterned conductive layer has a finger electrode portion. An active surface of a chip is faced toward the finger electrode portion. A polymer sealing frame is disposed between the chip and the dielectric substrate and surrounds the periphery of the chip to form a chamber together with the chip and the dielectric substrate. The mold sealing layer is disposed on the dielectric substrate and covers the chip and the polymer sealing frame. A manufacturing method of the SAW filter package structure is also disclosed.