SAW Filter Resin Sealing via Vacuum Bag Infiltration
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Solution Overview
Problem
Existing methods for manufacturing chip size packages (CSPs) for surface acoustic wave (SAW) filters face issues with void formation due to air bubble entrapment during the heat pressing process, leading to unstable seals and degradation over time, and require large-scale vacuum apparatuses for prevention.
Innovation Solution
A method involving reduced-pressure packing of electronic functional elements and a resin film in a gas-barrier bag, followed by hermetic sealing and resin infiltration, which minimizes voids and degradation by using a simple depressurizing apparatus and adjustable resin infiltration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat pressing process is used for resin sealing, then sealing can be achieved, but voids due to air bubble entrapment occur causing unstable seal and degradation over time
Solution Approach 1:
The patent applies preliminary action by placing the resin film and electronic components in a vacuum bag before the sealing process. The vacuum is applied in advance to remove air bubbles from the resin film and sealing areas, preventing void formation during the subsequent heat pressing process. This preliminary vacuum treatment ensures that no air pockets remain to cause degradation over time.
Solution Approach 2:
The patent creates an inert environment by using a vacuum bag that isolates the sealing process from atmospheric air. By maintaining vacuum conditions during resin infiltration and sealing, the process prevents air bubble entrapment and eliminates oxygen that could cause degradation. This inert environment approach ensures reliable sealing without void formation.
2Reliability
If vacuum sealing is used to prevent voids, then seal stability improves, but large-scale apparatus for placing entire system in vacuum is required
Solution Approach 1:
The patent applies segmentation by dividing the vacuum sealing process into two independent parts: (1) a simple vacuum bag for local vacuum application, and (2) a separate heat pressing process. Instead of placing the entire system in a large vacuum chamber, only the specific area containing the resin film and components needs to be vacuumed, significantly reducing apparatus complexity while maintaining seal reliability.
Solution Approach 2:
The patent introduces a vacuum bag as an intermediary element that enables local vacuum application without requiring a large-scale vacuum system. The bag acts as a mediator between the simple vacuum source and the resin sealing process, allowing void prevention through vacuum while keeping the overall apparatus simple and cost-effective.
3Reliability
If resin film is used for sealing, then sealing can be achieved, but air bubbles become trapped causing voids and characteristic degradation
Solution Approach 1:
The patent applies preliminary action by removing air bubbles from the resin film before the sealing process. The vacuum bag is used in advance to evacuate air from the resin film and sealing areas, ensuring that when heat pressing occurs, no air pockets remain to form voids. This preliminary vacuum treatment guarantees void-free sealing and maintains manufacturing precision.
Solution Approach 2:
The patent applies parameter changes by controlling the pressure parameter during resin infiltration. By maintaining vacuum conditions (low pressure) during resin application and allowing atmospheric pressure to push the resin into place after vacuum release, the process ensures complete resin infiltration without air bubble entrapment, achieving precise void-free sealing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method prevents voids and durability degradation, reduces costs by eliminating the need for large-scale vacuum equipment, and ensures stable sealing suitable for surface acoustic devices.
Implementation Method 1
sealing the electronic functional elements with a sealing resin member formed from the resin film by causing the resin film to infiltrate between the electronic functional elements
Implementation Method 2
putting the electronic functional elements and the resin film mounted on the collective mounting substrate in a bag with a gas-barrier property, and hermetically sealing the contents inside the back by closing the opening of the bag after depressurizing the inside of the bag
Data Source
AI summary
A method of manufacturing an electronic component minimizes the occurrence of voids and degradation of characteristics in a resin-sealed portion, while reducing the costs thereof. A sealing step for sealing surface acoustic wave elements by a sealing resin member formed from a resin film is performed by mounting the surface acoustic wave elements on a collective mounting substrate and the resin film in a bag with a gas-barrier property, and causing the resin film to infiltrate between the surface acoustic wave elements mounted on the reduce-pressured-packed collective mounting substrate to be hermetically sealed by the pressure difference between the inside and the outside of the bag.