SAW Filter Thermal Layer for High-Power Heat Dissipation
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Solution Overview
Problem
Surface acoustic wave filters face challenges in managing heat dissipation effectively, particularly when filtering high-power radio frequency signals, which can lead to increased temperatures and reduced durability.
Innovation Solution
Incorporating a thermally conductive layer with high thermal conductivity, such as aluminum nitride, thinner than the piezoelectric layer, to dissipate heat efficiently, while maintaining electrical insulation and being nontoxic, thereby reducing maximum chip temperature and enhancing power durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermally conductive layer is added to dissipate heat, then heat dissipation performance is improved, but device structure becomes more complex
Solution Approach 1:
The piezoelectric layer is designed to serve dual functions: maintaining its essential piezoelectric properties for signal processing while simultaneously acting as a thermally conductive layer for heat dissipation. This multi-functionality approach allows the device to improve heat dissipation performance without adding separate structural components, thereby resolving the contradiction between temperature management and device complexity
Solution Approach 2:
The thermal conductivity parameter of the piezoelectric layer is enhanced by selecting specific piezoelectric materials with higher thermal conductivity or by optimizing the layer's structural parameters. This parameter change allows the existing piezoelectric layer to achieve improved heat dissipation performance without increasing device structural complexity
2Temperature
If the piezoelectric layer thickness is increased to improve thermal conductivity, then heat dissipation is improved, but device size increases
Solution Approach 1:
The piezoelectric layer is designed as a composite structure combining materials with complementary properties: one component provides high piezoelectric performance while the other contributes high thermal conductivity. This composite approach enables the layer to achieve effective heat dissipation without requiring increased thickness, as the high thermal conductivity materials efficiently conduct heat through the existing layer depth
Solution Approach 2:
The piezoelectric layer is designed with spatially varying properties, where regions with higher thermal conductivity are positioned in areas requiring enhanced heat dissipation. This local optimization allows effective heat management without uniformly increasing the overall layer thickness, thereby maintaining compact device dimensions while improving thermal performance in critical areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of a thin thermally conductive layer significantly improves heat dissipation, reducing maximum chip temperature by up to 20°C and enhancing the power durability of surface acoustic wave filters, while minimizing material usage and manufacturing complexities.
Implementation Method 1
a thermally conductive layer configured to dissipate heat of the surface acoustic wave device
Implementation Method 2
an interdigital transducer electrode on the piezoelectric layer
Data Source
AI summary
Aspects of this disclosure relate to a surface acoustic wave device that includes a thermally conductive layer configured to dissipate heat of the surface acoustic wave device. The surface acoustic wave device includes a piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer. The thermally conductive layer can be thinner than the piezoelectric layer. Related radio frequency modules and wireless communication devices are disclosed.