SAW Filter Substrate Thickness for 2140 MHz Attenuation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional surface acoustic wave filters exhibit unsatisfactory filtering characteristics, particularly poor attenuation at 2140 MHz and its neighborhood, which affects their performance in portable telephone units.

Innovation Solution

The thickness of the piezoelectric substrate is reduced to not thicker than 0.2 mm, which improves the attenuation characteristic by reducing capacitance coupling and enhancing the filtering performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the piezoelectric substrate thickness is reduced to not thicker than 0.2 mm, then the attenuation characteristic at 2140 MHz is improved, but the manufacturing precision requirement increases

Engineering Contradiction:
Improvefiltering characteristicVSAvoidsubstrate thickness control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The invention changes the physical parameter of piezoelectric substrate thickness to not thicker than 0.2 mm, which fundamentally alters the capacitance coupling characteristics and improves attenuation at 2140 MHz. This parameter change directly resolves the technical contradiction by optimizing the filtering characteristic while establishing a new manufacturing specification.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the piezoelectric substrate thickness is reduced, then the capacitance coupling is reduced and attenuation at 2140 MHz is improved, but the structural stability may be compromised

Engineering Contradiction:
Improveattenuation characteristicVSAvoidsubstrate structural stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

By changing the substrate thickness parameter to not thicker than 0.2 mm, the invention optimizes the capacitance coupling effect to achieve better attenuation characteristics while maintaining structural integrity through precise parameter control.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If a conventional piezoelectric substrate thickness is used, then the manufacturing is easier, but the filtering characteristic remains unsatisfactory with poor attenuation at 2140 MHz

Engineering Contradiction:
Improvesubstrate fabricationVSAvoidfiltering characteristic
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The invention changes the substrate thickness parameter to not thicker than 0.2 mm, which improves filtering characteristics and attenuation at 2140 MHz. This parameter optimization balances manufacturing feasibility with performance requirements.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This thickness optimization results in improved attenuation characteristics, with attenuation amounts below -50 dB in the critical frequency range, enhancing the overall filtering capability of the surface acoustic wave filters and duplexers.

Implementation Method 1

surface acoustic wave filter

Methodology Applied
Scientific EffectSurface acoustic wave: Surface Acoustic Wave

Implementation Method 2

piezoelectric substrate 5 provided on the upper surfaces of resonators 3a ̃3e

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS7898360B2Surface acoustic wave filter and surface acoustic wave duplexer
Publication Date: 2011.03.01 SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN
  • US7898360B2 patent drawing
  • US7898360B2 patent drawing
  • US7898360B2 patent drawing

AI summary

A surface acoustic wave filter which includes a first terminal at the input side, a second terminal at the output side, a plurality of resonators electrically connected between the first and the second terminals, and a piezoelectric substrate provided on the upper surfaces of first and second terminals and the plurality of resonators. The piezoelectric substrate is made to have a thickness that is not thicker than 0.2 mm. The filtering characteristic of surface acoustic wave filter can be improved by taking advantage of the above structure.