SAW Package Frame Recesses for Cleaning Flow and Sealing
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Solution Overview
Problem
In surface acoustic wave devices, the frame surrounding the electronic component hinders the flow of cleaning solutions into and out of the gap between the component and the substrate, preventing effective removal of dirt and potential intrusion of sealing material.
Innovation Solution
Incorporating recesses in the frame adjacent to the electronic component allows for easy flow of cleaning solutions into and out of the gap between the component and the substrate, while preventing the sealing material from intruding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a frame is used to surround the electronic component to block intrusion of sealing material, then the sealing integrity is improved, but the cleaning solution flow is hindered
Solution Approach 1:
The frame is segmented by forming recesses that divide the continuous frame structure into sections. These recesses create channels that allow cleaning solution to flow through the frame structure, solving the contradiction between maintaining sealing integrity and enabling cleaning solution flow.
Solution Approach 2:
The frame has different local properties: the main body of the frame provides sealing function, while the recess portions provide cleaning solution passage function. This local differentiation allows the frame to simultaneously achieve both sealing integrity and cleaning accessibility.
2Reliability
If the gap between the electronic component and substrate is sealed, then the sealing material intrusion is prevented, but the cleaning of remaining dirt is hindered
Solution Approach 1:
The recesses in the frame are formed beforehand to create flow paths for cleaning solution. This preliminary structural preparation ensures that cleaning solution can access the gap between the electronic component and substrate before sealing is completed, allowing effective removal of remaining dirt while maintaining subsequent sealing effectiveness.
Data Source
AI summary
A surface acoustic wave device includes a surface acoustic wave element including a functional element and a bump on one main surface, a substrate on which the surface acoustic wave element is mounted by using the bump as a joint, a frame positioned on the substrate to surround the surface acoustic wave element in a plan view of the surface acoustic wave element mounted on the substrate, and a sealing material that seals the surface acoustic wave element and seals a gap between the frame and the electronic component. The frame includes at least one recess adjacent to the surface acoustic wave element.