SAW-less Receiver Architecture Integrating Transimpedance Amplifiers
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Solution Overview
Problem
Current wireless communication devices require expensive discrete components like SAW filters, duplexers, and inductors to meet performance standards for 2G and 3G protocols, which are not scalable with advancements in IC fabrication, leading to redesign challenges and increased costs.
Innovation Solution
The development of a SAW-less receiver and transmitter architecture that incorporates frequency translated bandpass filters (FTBPF) and power amplifier drivers, eliminating the need for discrete components by integrating their functionality into a system on a chip (SOC) and front-end module (FEM), allowing for scalable and cost-effective implementation across various wireless communication standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete components like SAW filters, duplexers, and inductors are used to meet performance standards, then performance requirements are satisfied, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple discrete components (SAW filters, duplexers, inductors) into an integrated receiver circuit implemented as a single IC. The receiver includes a low noise amplifier, down-conversion mixers, and filtering stages all integrated together, eliminating the need for separate discrete components while maintaining performance standards for 2G and 3G protocols.
Solution Approach 2:
The integrated receiver circuit is designed to support multiple wireless communication standards (2G, 3G, and future standards) through a universal architecture. The receiver can operate across different frequency bands and protocols without requiring redesign, as the integrated circuit incorporates configurable filtering and mixing stages that can be programmed for various standards.
2Reliability
If discrete components are used to meet performance standards, then performance requirements are satisfied, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple discrete components (SAW filters, duplexers, inductors) into an integrated receiver circuit implemented as a single IC. The receiver includes a low noise amplifier, down-conversion mixers, and filtering stages all integrated together, eliminating the need for separate discrete components while maintaining performance standards for 2G and 3G protocols.
Solution Approach 2:
The patent utilizes modern IC fabrication parameters and processes to achieve performance previously only attainable with discrete components. By leveraging advances in semiconductor manufacturing, the integrated circuit achieves the required filtering performance, noise figures, and frequency ranges without needing external discrete components, thereby reducing manufacturing complexity and cost.
3Reliability
If discrete components are used in the receiver architecture, then performance is maintained, but scalability with IC fabrication advancements is limited
Solution Approach 1:
The integrated receiver circuit is designed to support multiple wireless communication standards (2G, 3G, and future standards) through a universal architecture. The receiver can operate across different frequency bands and protocols without requiring redesign, as the integrated circuit incorporates configurable filtering and mixing stages that can be programmed for various standards.
Solution Approach 2:
The receiver incorporates dynamically configurable filtering and mixing stages that can be reprogrammed for different wireless standards and frequency bands. This dynamic reconfigurability allows the same integrated circuit to adapt to future IC fabrication advancements and support emerging communication protocols without requiring physical redesign or additional discrete components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces the need for external discrete components, enhances scalability with IC process advancements, and optimizes performance across multiple wireless communication standards, thereby lowering production costs and improving device efficiency.
Implementation Method 1
The first and second down-conversion mixers each include a transimpedance amplifier, including a first transimpedance amplifier and a second transimpedance amplifier, respectively
Data Source
AI summary
A SAW-less receiver includes an FEM interface module, an RF to IF receiver section, and a receiver IF to baseband section. The RF to IF receiver section includes inverter based LNA modules, a mixing module, and transimpedance amplifier modules. The inverter based LNA modules amplify inbound RF signal to produce a positive leg current RF signal and a negative leg current RF signal. The mixing module converts the positive and negative leg current RF signals into an in-phase (I) mixed current signal and a quadrature (Q) mixed current signal. The transimpedance amplifier modules convert the I mixed current signal into an I mixed voltage signal and the Q mixed current signal into a Q mixed voltage signal. The receiver IF to baseband section converts the I and Q mixed voltage signals into one or more inbound symbol streams.