SAW Package Conductive Pillar for Heat Dissipation and Ruggedness
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Solution Overview
Problem
Existing packaged surface acoustic wave devices are bulky and lack efficient heat dissipation and mechanical ruggedness, limiting their integration in smaller and thinner electronic systems.
Innovation Solution
A packaged surface acoustic wave device with a conductive pillar and roof structure that supports the roof structure without electrical communication, combined with a multilayer piezoelectric substrate and conductive vias for improved heat dissipation and mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional package structure is used to protect the surface acoustic wave device, then the device is protected, but the package increases the overall size of the device
Solution Approach 1:
The patent transitions from a planar packaging approach to a three-dimensional structure by introducing a roof element that extends vertically above the substrate. This vertical dimension allows the package to enclose and protect the IDT electrodes while maintaining a compact footprint on the substrate plane, thus reducing the overall device volume without compromising protection.
Solution Approach 2:
The patent embeds the IDT electrodes within a cavity formed by the substrate and roof structure. The electrodes are nested inside the protective enclosure rather than being exposed on the surface, allowing the package to protect multiple components within a compact integrated structure.
2Strength
If the package structure is made thicker to improve mechanical ruggedness, then mechanical strength is improved, but the device becomes larger
Solution Approach 1:
The patent employs a composite structure combining a substrate material (such as ceramic or metal) with a roof element made of the same or different material. This composite construction provides enhanced mechanical strength and ruggedness through the synergistic properties of the combined materials while maintaining a compact thickness.
Solution Approach 2:
The package structure is segmented into distinct functional elements: the substrate forming the base, the roof element providing top protection, and side walls enclosing the cavity. This segmentation allows each component to be optimized for its specific function while contributing to overall mechanical strength without increasing total thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation and mechanical ruggedness, allowing for smaller and thinner devices suitable for radio frequency applications.
Implementation Method 1
The second conductive pillar can be configured to dissipate heat generated by the interdigital transducer electrode
Implementation Method 2
a piezoelectric layer over the support substrate, an interdigital transducer electrode over the piezoelectric layer
Data Source
AI summary
A packaged surface acoustic wave device is disclosed. the packaged surface acoustic wave device can include a support substrate that includes a conductive via formed therein, a piezoelectric layer over the support substrate, an interdigital transducer electrode over the piezoelectric layer, a roof structure over the interdigital transducer electrode, and a conductive pillar between the support substrate and the roof structure. The conductive pillar supports the roof structure and defines at least a portion of an electrical pathway between the interdigital transducer electrode and the conductive via. The roof structure is configured such that there is no signal communication between the conductive pillar and the roof structure.