SAW Package Structure Using Resin Coating for Thin Conductive Terminals
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Solution Overview
Problem
There is a demand for smaller and thinner packaged surface acoustic wave devices to fit into smaller modules while maintaining electrical performance and moldability strength, as existing packaging methods result in larger device sizes and higher costs.
Innovation Solution
The use of a photosensitive buffer coat layer and laser marking on a piezoelectric substrate to reduce the package height and eliminate the need for additional marking films, combined with a cavity structure and conductive layer formation using plating and spin-coating processes, allows for a thinner and more cost-effective packaging solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If traditional packaging methods are used for surface acoustic wave devices, then structural protection and electrical performance are maintained, but the device size and height increase
Solution Approach 1:
The patent removes the separate marking film layer from the packaging structure, integrating the marking function directly into the piezoelectric substrate through laser marking. This extraction of the redundant marking film layer directly reduces the overall package height while maintaining all necessary functional properties including structural integrity and electrical performance.
Solution Approach 2:
The patent combines multiple functions into the piezoelectric substrate itself: the substrate serves as both the acoustic wave propagation medium and the marking surface. By merging the marking function into the substrate through laser-induced modifications, the design eliminates the need for a separate marking film layer, thereby reducing package height while preserving structural and electrical properties.
2Loss of information
If additional marking films and layers are added to the package structure, then identification and tracking are improved, but the package height and complexity increase
Solution Approach 1:
The patent extracts the marking function from a separate film layer and integrates it directly into the piezoelectric substrate. This eliminates the need for additional marking films while preserving the identification and tracking capabilities, thereby reducing package height and structural complexity.
Solution Approach 2:
The piezoelectric substrate is given multiple functions: it serves as the acoustic wave propagation medium, the structural support element, and the marking surface for device identification. This multi-functionality eliminates the need for separate marking films, reducing package height while maintaining identification capabilities.
3Manufacturing precision
If multiple processing steps including spin-coating, plating, and marking film application are used, then packaging quality is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent removes the marking film application step from the manufacturing process entirely, replacing it with direct laser marking of the piezoelectric substrate. This extraction of the redundant marking film step reduces manufacturing complexity and cost while maintaining packaging quality through the same spin-coating and plating processes.
Solution Approach 2:
The laser marking is performed on the piezoelectric substrate before packaging assembly, preparing the substrate with integrated marking functionality in advance. This preliminary action eliminates the need for subsequent marking film application steps, simplifying the overall manufacturing process while ensuring high packaging quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach achieves a package height of less than 220 micrometers, reducing the overall thickness of the surface acoustic wave device while maintaining structural integrity and electrical performance, and simplifies the manufacturing process by minimizing processing steps.
Implementation Method 1
a photosensitive buffer coat layer over the conductive structure
Implementation Method 2
conductive structure extending over a portion of an outer surface of the cavity structure
Implementation Method 3
a insulating layer extending over the conductive structure
Data Source
AI summary
Methods of making packaged surface acoustic wave devices are provided. The method may include forming a photosensitive resin coat over a cavity-defining structure encapsulating a surface acoustic wave device. The photosensitive resin coat may be formed using a spin-coating process, and then patterned to form a desired shape. Portions of the photosensitive resin may be removed from areas near the edge of the die, to facilitate separation of a wafer into individual dies. The method may also include forming a conductive structure using a plating process, where the conductive structure is located between the resin coat and the cavity defining structure. The photosensitive resin can include a phenol resin. The packaged surface acoustic wave devices made using a photosensitive resin coat may be relatively thin, and may have a height of less than 220 micrometers.