Surface Acoustic Wave Package Sealing Without Post-Mold Steps
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Solution Overview
Problem
The conventional wafer level package method for manufacturing miniaturized surface acoustic wave device packages faces efficiency issues in mass production due to the need for a molding process to prevent moisture and contamination, which complicates the process and reduces productivity.
Innovation Solution
A method involving a first and second substrate with surface acoustic wave devices in between, where a protection member is formed to wrap the cut substrates and electrode patterns, and then flattened to expose electrode pads, allowing for the separation of miniaturized packages with a reduced protection member, enhancing manufacturing efficiency and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a molding process is performed after individually attaching surface acoustic wave devices on a substrate to prevent moisture or contaminated materials infiltration, then reliability is improved, but device complexity and manufacturing time increase
Solution Approach 1:
The patent applies preliminary action by forming the protection member before the cutting process. The protection member is formed to wrap the cut space and top surface of the substrate, and then the substrate is cut along partitioning lines to separate individual devices. This eliminates the need for a subsequent molding process, as the protection member is already in place before devices are separated, thereby reducing manufacturing complexity while maintaining reliability
Solution Approach 2:
The patent merges the protection function with the substrate structure itself. The protection member is integrated into the substrate during the cutting process, combining the substrate and protection functions into a unified structure. This eliminates the need for a separate molding process step, reducing device complexity while ensuring protection against moisture and contamination
2Reliability
If a molding process is performed after individually attaching surface acoustic wave devices on a substrate to prevent moisture or contaminated materials infiltration, then reliability is improved, but productivity decreases
Solution Approach 1:
The protection member is formed before the cutting process, allowing multiple devices to be prepared with protection simultaneously. The substrate is then cut along partitioning lines to separate individual devices, each already having protection in place. This eliminates the need for individual molding operations for each device, significantly improving mass production efficiency while maintaining reliability
Solution Approach 2:
The substrate containing multiple surface acoustic wave devices is cut along partitioning lines to separate individual devices. Each device retains its protection member from the original substrate structure. This segmentation approach allows parallel processing and mass production without requiring individual molding for each device, thereby improving productivity while ensuring each device is protected
3Ease of manufacture
If a protection member is used to wrap cut substrates and then flattened to expose electrode pads, then manufacturing is simplified, but the protection member must be precisely controlled in size and shape
Solution Approach 1:
The protection member is designed with different regions having different functions: one region wraps the cut space and top surface for protection, while another region is flattened to expose electrode pads for electrical connection. This local differentiation allows the protection member to serve multiple purposes with precise dimensional control in specific areas, simplifying manufacturing while meeting precision requirements where critical
Data Source
AI summary
The present invention relates to a surface acoustic wave device package and a method of manufacturing the same, and more specifically, to a method of manufacturing a miniaturized surface acoustic wave device package.