SAW Wafer-Level Package with Thermal Pillars for High-Power Heat Dissipation

The patent segments the thermal management function by introducing separate thermal conduction pathways through highly thermally conductive pillars (metal interconnect layers) that are spatially distributed across the device. These pillars create multiple parallel heat dissipation channels from the piezoelectric layer to the substrate, preventing localized thermal accumulation and enabling higher power operation without thermal runaway.

The patent introduces highly thermally conductive pillars (metal interconnect layers) as intermediary structures between the piezoelectric layer (heat source) and the substrate (heat sink). These pillars act as thermal mediators with high thermal conductivity, efficiently transferring heat away from the active region and preventing excessive self-heating while maintaining electrical isolation where needed.

The patent makes the metal interconnect layers serve dual functions: (1) providing electrical interconnection between device layers, and (2) acting as highly thermally conductive pillars for heat dissipation. This multi-functionality eliminates the need for separate thermal management structures, maintaining low device complexity while dramatically improving thermal dissipation reliability through the high thermal conductivity of metals.

The patent creates a composite thermal management system combining polymeric materials (for structural support and insulation) with highly thermally conductive metal interconnect layers (for heat dissipation). This composite approach leverages the advantages of both material types: the polymeric materials provide mechanical stability and electrical isolation, while the metal layers provide efficient thermal conduction pathways.